Ultra-thin heat dissipation plate

Abstract

The invention provides an ultra-thin heat dissipation plate, which comprises an upper-layer heat dissipation sheet, a lower-layer heat dissipation sheet, a macromolecule water absorption coating and asealing ring, wherein the thickness of the upper-layer heat dissipation sheet is 0.05-0.15mm, and a plurality of small convex bodies are arranged below the upper-layer heat dissipation sheet; the thickness of the lower-layer heat dissipation sheet is 0.05-0.15mm, and the lower-layer heat dissipation sheet corresponds to the upper-layer heat dissipation sheet; the macromolecule water absorption coating is formed on the upper surface of the lower-layer heat dissipation sheet, and a capillary structure exists in the macromolecule water absorption coating; and the sealing ring is positioned between the upper-layer heat dissipation sheet and the lower-layer heat dissipation sheet; the upper-layer heat dissipation sheet and the lower-layer heat dissipation sheet are supported by the small convex bodies of the upper-layer heat dissipation sheet to prevent collapsing, a hollow cavity with the internal space of 0.05-0.15mm is formed, the cavity is filled with a heat dissipation fluid and is then sealed after the heat dissipation fluid is filled and vacuumized, so that the ultra-thin heat dissipation plate with the total thickness of less than 0.5mm is formed. The ultra-thin heat dissipation plate not only has excellent heat dissipation performance, but also is beneficial to the development of a mobile electronic device in light, thin and multiplex directions.

Description

technical field [0001] The invention relates to a cooling plate, in particular to an ultra-thin cooling plate whose total thickness is less than 0.5mm. Background technique [0002] Mobile electronic devices tend to be thinner and more multitasking, and due to the increase in the density and frequency of electronic components, local overheating will occur after a long period of use. Usually, the chips of mobile electronic devices are the main heat source during work. Heat dissipation is not only a In order to reduce the temperature of the chip itself to ensure that it can work normally within the required temperature range, and at the same time take into account that the heat dissipation will not cause local overheating of the shell, causing bad user experience to consumers, the current heat dissipation methods of mobile electronic devices mainly use Simple openings, heat conduction, heat convection, etc., but these heat dissipation methods can no longer meet the heat energy...

AI Technical Summary

Problems solved by technology

However, the thickness of the commercially available radiator plate is not easy to be thinned because of the thickness of the copper mesh, so the thickness of the flat heat pipe 20 radiator plate is all above 0.55mm, which is not conducive to the development of mobile electronic devices in the direction of thinner and multi-tasking, which directly leads to this type of heat sink. Heat sinks cannot be applied to mobile electronic devices that have high requirements for thickness, such as mobile phones and tablets

Furthermore, the capillary force of the copper mesh is not strong enough, and the heat dissipation effect is not ideal, which also leads to the development of the thinner heat sink.

[0010] In addition, in the prior art, when the heat pipe or vapor chamber is thinned, the overall thinning is adopted, which makes it difficult for the thin heat pipe to be filled with powder and sintered after being thinned, and it is difficult to realize an extremely thin structure, or to be pressed after powder filled and sintered. When forming a flat structure, the sintered powder or other capillary structures (grid or fiber) inside the heat pipe will be damaged by extrusion and lose energy

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