Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Transmission system

A transmission system and wafer transfer box technology, applied in the field of transmission systems, can solve the problem that wafers cannot be processed in time

Pending Publication Date: 2020-07-31
YANGTZE MEMORY TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the related technical problems, the embodiment of the present invention proposes a transmission system, which can alleviate the problem that the wafers that need to be processed first cannot be processed in time at least to a certain extent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transmission system
  • Transmission system
  • Transmission system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In order to make the technical solutions and advantages of the embodiments of the present invention more clear, the specific technical solutions of the invention will be further described in detail below in conjunction with the drawings in the embodiments of the present invention.

[0042] In the related art, the transport system can transport the FOUP loaded with the wafers to be processed into the wafer loading port, so as to enter the reaction chamber through the wafer loading port for process processing; at the same time, the transport system It is also possible to transfer the wafers from the wafer loading port to the FOUP temporary storage area after the FOUP loaded with process-processed wafers returns to the FOUP to wait for the next process deal with.

[0043]The implementation principle of transferring the wafers to be processed to the wafer loading port by the transfer system is as follows: the transfer system includes a handling device and a wafer loading po...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides a transmission system, which comprises a plurality of wafer loading ports, a control device and a first carrying device, wherein the plurality of wafer loadingports are arranged in a plurality of rows and are arranged on a first supporting member, the first supporting member is used for being arranged at the inlet end of a semiconductor machine electrode lugle, and the first carrying device is used for carrying a wafer transfer box loading a wafer from a first temporary storage area to the corresponding wafer loading port after receiving the first instruction of the control device so as to make the grabbing device of the semiconductor machine electrode lugle obtain the wafer from the wafer transfer box, and transferring the obtained wafer to the reaction cavity of the semiconductor machine electrode lugle so as to carry out semiconductor process treatment.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a transmission system. Background technique [0002] In the semiconductor manufacturing process, the semiconductor machine is used to specifically execute the process in the manufacturing process. In the semiconductor manufacturing process, the wafer is placed in the wafer transfer box (English expression is Front Opening Unified Pod, referred to as FOUP), and the wafer transfer box is transported to the designated position at the entrance of the corresponding semiconductor machine through the transmission system. The transmission system includes: a handling device and a wafer loading port; wherein, the handling device (for example, an aerial hoisting trolley (English expression is Overhead Hoist Transport, referred to as OHT)) picks up the wafer transfer box and transports the wafer transfer box to The entrance port of the corresponding semiconductor machine...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/677
CPCH01L21/67739H01L21/67763
Inventor 李明刘隆冬周颖
Owner YANGTZE MEMORY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com