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A self-healing in-situ fluorescent tracer heat-resistant and weather-resistant epoxy resin and its preparation method

A fluorescent tracer and epoxy resin technology, applied in the field of high-performance polymers, can solve the problems of high curing temperature, long repair time, high self-repair temperature, etc., achieve high mechanical strength, improve mechanical properties and heat and weather resistance, Improves the effectiveness of repair sites

Active Publication Date: 2021-10-01
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the self-repair method of epoxy resin is mostly landfill method: Chinese patent 200810025911.4 discloses an epoxy resin nano-microcapsule and its preparation method [Cai Xiulan, Qu Ailan, Fu Datian. An epoxy resin nano-microcapsule and its Preparation method; CN 104945847 A[P].2015.], the material is subjected to external force to cause cracks to expand, the microcapsules rupture and the liquid epoxy resin flows out, and the catalyst triggers the liquid resin to solidify at high temperature. Although this method solves the repair problem to a certain extent , but also faces many challenges: the cost of the catalyst or the instability and dispersion in the matrix, or the structure of the repaired part and the matrix is ​​different; Chinese patent 201410209131.0 discloses a self-healing epoxy resin containing hollow fibers Composite material [Su Junfeng. A self-healing epoxy resin composite material containing hollow fibers; CN 103937164 A[P].2014.], when the composite material cracks, the fiber breaks and releases dicyclopentadiene for repair. This method There are also certain limitations: for example, the introduction of hollow fibers into brittle materials can easily cause stress concentration; hollow fibers are not suitable for the repair of smooth surface materials due to their relatively large size.
Chinese patent 201510979587.X discloses a self-healing epoxy powder coating and its preparation method [Ren Hua, Zhu Jiting, Gu Tingting, et al. A self-healing epoxy powder coating and its preparation method; CN 105400377 A[P].2015], using the reversible exchange ester bond to realize the self-healing function of the material, but it needs to be baked at 180-300℃ for more than 10h to achieve self-healing, the self-healing temperature is too high and the time is too long
Generally speaking, the current preparation method of self-healing epoxy resin based on reversible exchange ester bonds has technical deficiencies: first, the curing temperature is too high and the resin has poor heat and weather resistance and mechanical properties; second, the repair method is single and the repair time is too long Long, can not meet the repair under specific circumstances; the third is unable to realize the visualization of the evolution process of the reversible exchange ester bond in the repair process

Method used

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  • A self-healing in-situ fluorescent tracer heat-resistant and weather-resistant epoxy resin and its preparation method
  • A self-healing in-situ fluorescent tracer heat-resistant and weather-resistant epoxy resin and its preparation method
  • A self-healing in-situ fluorescent tracer heat-resistant and weather-resistant epoxy resin and its preparation method

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Embodiment 2

[0035] Mix the curing agent methyl hexahydrophthalic anhydride and the catalyst chromium acetylacetonate in a molar ratio of 100:5 and add them into the beaker for ultrasonic stirring, the ultrasonic power is 80kW, the temperature is 50°C, the stirring speed is 600r / min, and the time is 1h; Under the conditions of temperature 180°C and vacuum degree -0.1MPa, treat for 3 hours until no bubbles are generated; mix tetraglycidyl diaminodiphenylmethane (epoxy equivalent 110-125g / eq) with 3,4-epoxycyclohexylmethyl The mixture of base (epoxy equivalent is 130-135g / eq) and the activated curing system are mixed according to epoxy equivalent: acid anhydride equivalent = 1:1, and the mixing conditions are oil bath temperature 90°C, stirring speed 500r / min, time 10min; The mixed resin glue is degassed at a temperature of 70°C, and then poured into a metal mold for curing treatment. The curing condition is 100°C / 2h+120°C / 2h+150°C / 2h, and it is naturally cooled and demoulded. Afterwards, a ...

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Abstract

The invention provides a self-repairing in-situ fluorescence tracing type heat-resistant and weather-resistant epoxy resin and a preparation method thereof. The preparation method guarantees its basic mechanical properties by selecting glycidyl ethers, glycidyl esters, and glycidyl amines as the main resin, and uses hydantoin epoxy resin and alicyclic epoxy resin as component resins to improve its heat resistance and weather resistance. , choose acidic curing agent to build reversible exchange ester bond to endow it with self-healing function, choose acetylacetone metal salt as catalyst to reduce curing temperature and catalyze the break-generation reaction of reversible exchange ester bond, use aminated nanoparticles to adjust the temperature resistance of resin matrix And realize in situ fluorescent tracer repair process. The self-repairing epoxy resin prepared based on the technical solution of the present invention has simple preparation process, high self-repairing efficiency, various repairing methods, fluorescent tracer in the repairing process, multiple repairs, and can be used in pressure vessels, electronic packaging, aerospace, transportation, etc. Transportation, sporting goods and other fields.

Description

technical field [0001] The invention relates to the field of high-performance polymers, and mainly relates to a self-repairing in-situ fluorescent tracer type heat-resistant and weather-resistant epoxy resin and a preparation method thereof. Background technique [0002] With the development of social life and industrial technology, polymers are widely used in various aspects of production and life, such as building panels, auto parts, and electronic components, due to their excellent mechanical properties, light specific gravity, and easy processing and molding. and printed circuit boards. High molecular polymers will inevitably produce crack damage under the action of the external environment, which will reduce the mechanical properties of the material and shorten the service life of the material. Traditional methods such as mechanical connection, plastic welding, and bonding can be applied to the repair of visible cracks in materials, but they are not suitable for intern...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/42C08G59/70C08K9/04C08K3/04C08K3/22C08K3/34C08K7/18
CPCC08G59/4207C08G59/4215C08G59/70C08K3/22C08K3/34C08K7/18C08K9/04C08K2003/2241C08K2003/2244C08K2003/2275C08K2201/011C08K3/041C08K3/042
Inventor 贾晓龙黎何丰罗锦涛史可刘聪还献华杨小平
Owner BEIJING UNIV OF CHEM TECH
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