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Preparation method of large-scale flake ultra-high thermal conductivity diamond/copper composite material

A technology for composite materials and composite material components, which is applied in the field of preparation of large-scale thin sheet ultra-high thermal conductivity diamond/copper composite materials, which can solve the problems of poor interface bonding strength and low thermal conductivity of diamond/copper, and achieve production cycle Short, good thermal expansion coefficient, and the effect of reducing interface thermal resistance

Active Publication Date: 2021-08-31
哈尔滨锦威科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention aims to solve the technical problems of low thermal conductivity and poor interfacial bonding strength of the diamond / copper composite material prepared by the existing method, and proposes a preparation method of a large-size flake-shaped ultra-high thermal conductivity diamond / copper composite material

Method used

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  • Preparation method of large-scale flake ultra-high thermal conductivity diamond/copper composite material
  • Preparation method of large-scale flake ultra-high thermal conductivity diamond/copper composite material
  • Preparation method of large-scale flake ultra-high thermal conductivity diamond/copper composite material

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specific Embodiment approach 1

[0033] Specific Embodiment 1: The preparation method of the large-size flake-shaped ultra-high thermal conductivity diamond / copper composite material in this embodiment is carried out according to the following steps:

[0034] 1. Filling the diamond particles coated with the metal film into the cavity of the graphite mold to obtain a preform; the filling amount of the diamond particles coated with the metal film is 60% to 85% of the volume of the graphite mold cavity;

[0035] 2. Place the prefabricated body in the crucible, place the block of pure copper on the upper part of the prefabricated body in the crucible, and place the crucible in the air pressure infiltration furnace;

[0036] 3. Preheat the prefabricated body to 1000-1050°C in an argon protective atmosphere and keep it warm for 1-5 hours to complete the microstructure control of the interface layer material;

[0037] 4. Under the protective atmosphere, raise the temperature of the pressure infiltration furnace to 1...

specific Embodiment approach 2

[0046] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is: the diamond particles coated with a metal film are described in step 1, and the metal film on the diamond particles coated with a metal film is prepared by a magnetron sputtering method. Before magnetron sputtering, pickling and alkali washing are carried out on the diamond particles in sequence until the surface roughness is 50nm-200nm;

[0047] The magnetron sputtering temperature is 100-400°C;

[0048] The particle size of the diamond particles is one of 90-110 μm, 110-400 μm, or a mixture of two in any proportion, wherein the diamond particles are single crystal diamond particles; the diamond-copper composite prepared by using 90-110 μm diamond particles The thermal conductivity of the material component is 750-1000W / mK, and the thermal conductivity of the diamond-copper composite material component prepared by using 110-400μm diamond particles is 800-1300W / mK. The thermal c...

specific Embodiment approach 3

[0050] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the specific process of pickling is: soaking in aqua regia at room temperature for 3 to 5 hours; the specific process of alkali cleaning is: at a concentration of 0.05- Soak in 5g / mL sodium hydroxide solution at room temperature for 3-5 hours.

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Abstract

The invention discloses a method for preparing a large-scale flake-like ultra-high thermal conductivity diamond / copper composite material, relating to a method for preparing a diamond / copper composite material. The purpose is to solve the problems of low thermal conductivity and poor interfacial bonding strength of diamond / copper composites. Method: Fill the diamond particles coated with metal film into the cavity of the graphite mold to obtain the preform; the preform is placed in the crucible, and the block pure copper and copper alloy are placed on the upper part of the preform in the crucible, and placed in the air pressure In the impregnation furnace, under the protective atmosphere of argon, the microstructure and morphology of the interface layer material are controlled, the temperature is raised to melt copper, heat preservation and pressure-holding infiltration, and finally pressure-holding stepwise cooling. The diamond volume fraction in the obtained composite material member is 60%-85%, the thermal conductivity reaches 1500W / mK, the side length reaches 60-130mm, and the thickness reaches 0.2-4mm. The invention is suitable for preparing diamond / copper composite material with high thermal conductivity.

Description

technical field [0001] The invention relates to a preparation method of a large-scale flake-like ultra-high thermal conductivity diamond / copper composite material. Background technique [0002] With the continuous improvement of the power and integration of various devices, traditional heat conduction and heat dissipation materials have gradually become difficult to meet the demand. As a new generation of thermal management materials, high thermal conductivity diamond / copper composite materials are characterized by their excellent thermal conductivity and low thermal expansion coefficient. , Widely used in integrated heat sinks, laser diode heat sink substrates, solid-state laser heat sinks, CPU heat sinks or heat sinks, high-power electronic device substrates (such as IGBT substrates), LED and HB-LED heat sinks, RF and microwave packaging Heat sinks, microelectronic packaging heat sinks, thermal management materials for high heat load electronic devices, and many other fiel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C26/00C22C1/10
CPCC22C9/00C22C26/00C22C1/101C22C1/1036C22C1/1052
Inventor 武高辉芶华松林秀陈国钦王平平修子扬杨文澍张强
Owner 哈尔滨锦威科技有限公司
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