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A kind of graphene-gold bonding wire and its preparation method and application

A graphene and bonding wire technology, used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc. The effect of high tensile strength, improved bonding performance and uniform organization

Inactive Publication Date: 2021-08-31
江西森通新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the content of silver in the above-mentioned silver-tin-graphene composite bonding wire is as high as 88.5-94.95%. Since silver is easily oxidized, the silver-tin-graphene composite bonding wire is easy to produce burning pellets during the wire bonding process. , Sliding ball phenomenon seriously affects its bonding performance

Method used

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  • A kind of graphene-gold bonding wire and its preparation method and application
  • A kind of graphene-gold bonding wire and its preparation method and application
  • A kind of graphene-gold bonding wire and its preparation method and application

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Effect test

Embodiment 1

[0038] A graphene-gold bonding wire, comprising: 0.05% graphene, 0.0005% lanthanum, 0.0005% cerium, 60% gold, 39.947% silver, and the balance is unavoidable impurities.

[0039] The preparation method of above-mentioned graphene-gold bonding wire, comprises the following steps:

[0040] S11, prepare graphene-gold composite powder material:

[0041] Prepare AuCl with a concentration of 0.12mol / L 3 Aqueous solution 5L.

[0042] Graphene with a quality of 8g was placed in the prepared AuCl 3 In the aqueous solution, apply electromagnetic stirring and ultrasonic dispersion at the same time, adjust the pH value of the solution to 13 with a concentration of 20wt% ammonia water, and drop in a formaldehyde reducing agent with a concentration of 15wt% under the condition of a reaction temperature of 60°C to 90°C Carry out reduction, rinse and filter with deionized water after the reaction is completed, place the collected reaction product in a drying oven to dry, and obtain a graphe...

Embodiment 2

[0065] A graphene-gold bonding wire, comprising: 0.1% graphene, 0.0008% lanthanum, 0.0010% cerium, 70% gold, 29.898% silver, and the balance is unavoidable impurities.

[0066] The preparation method of above-mentioned graphene-gold bonding wire, comprises the following steps:

[0067] S21, prepare graphene-gold composite powder material:

[0068] Prepare AuCl with a concentration of 0.13mol / L 3 Aqueous solution 8L.

[0069] Graphene with a quality of 10g was placed in the prepared AuCl 3 In the aqueous solution, apply electromagnetic stirring and ultrasonic dispersion at the same time, adjust the pH value of the solution to 14 with ammonia water with a concentration of 30wt%, and drop in a formaldehyde reducing agent with a concentration of 30wt% under the condition of a reaction temperature of 60°C to 90°C Carry out reduction, rinse and filter with deionized water after the reaction is completed, place the collected reaction product in a drying oven to dry, and obtain a g...

Embodiment 3

[0093] A graphene-gold bonding wire, comprising: 0.90% graphene, 0.0010% lanthanum, 0.0100% cerium, 80% gold, 19.086% silver, and the balance is unavoidable impurities.

[0094] The preparation method of above-mentioned graphene-gold bonding wire, comprises the following steps:

[0095] S31, prepare graphene-gold composite powder material:

[0096] Prepare AuCl with a concentration of 0.15mol / L 3 Aqueous solution 10L.

[0097] Graphene with a quality of 15g was placed in the prepared AuCl 3 In the aqueous solution, apply electromagnetic stirring and ultrasonic dispersion at the same time, adjust the pH value of the solution to 13 with a concentration of 20wt% ammonia water, and drop in a formaldehyde reducing agent with a concentration of 40wt% under the condition of a reaction temperature of 60°C to 90°C Carry out the reduction, rinse and filter with deionized water after the reaction is completed, place the collected reaction product in a drying oven to dry, and obtain a ...

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Abstract

The invention provides a graphene-gold bonding wire and its preparation method and application. The graphene-gold bonding wire comprises: 0.05%-1.0% of graphene, 0.0005%-0.001% of lanthanum, and 0.0005%-0.010% of cerium in terms of mass percentage , 60% to 80% of gold, 19% to 39.94% of silver, and the balance is unavoidable impurities. The graphene-gold bonding wire of the present invention is used in integrated circuit packaging, can be used as a substitute for bonding gold wire, has low cost, and has good wire bonding effect.

Description

technical field [0001] The invention relates to the technical field of bonding wires for packaging, in particular to a graphene-gold bonding wire and its preparation method and application. Background technique [0002] Microelectronics wire bonding is a method of using fine metal wires, using heat, pressure, and ultrasonic energy to tightly weld the metal wires and substrate pads to achieve electrical interconnection between chips and substrates and information exchange between chips. Under ideally controlled conditions, electron sharing or interdiffusion of atoms occurs between the lead and the substrate, enabling atomic-scale bonding between the two metals. [0003] At present, in high-end LED, COB and multi-pin IC integrated circuit packages, bonding wires are mostly bonded gold wires and gold alloy wires. Among them, the gold content in the bonding gold wire reaches more than 99.99%, which is the top product among all bonding wires, but the price of the bonding gold wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/49H01L23/482
CPCH01L21/4814H01L21/4885H01L23/4827H01L23/49
Inventor 吴国防许三龙
Owner 江西森通新材料科技有限公司
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