A kind of graphene-gold bonding wire and its preparation method and application
A graphene and bonding wire technology, used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc. The effect of high tensile strength, improved bonding performance and uniform organization
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Embodiment 1
[0038] A graphene-gold bonding wire, comprising: 0.05% graphene, 0.0005% lanthanum, 0.0005% cerium, 60% gold, 39.947% silver, and the balance is unavoidable impurities.
[0039] The preparation method of above-mentioned graphene-gold bonding wire, comprises the following steps:
[0040] S11, prepare graphene-gold composite powder material:
[0041] Prepare AuCl with a concentration of 0.12mol / L 3 Aqueous solution 5L.
[0042] Graphene with a quality of 8g was placed in the prepared AuCl 3 In the aqueous solution, apply electromagnetic stirring and ultrasonic dispersion at the same time, adjust the pH value of the solution to 13 with a concentration of 20wt% ammonia water, and drop in a formaldehyde reducing agent with a concentration of 15wt% under the condition of a reaction temperature of 60°C to 90°C Carry out reduction, rinse and filter with deionized water after the reaction is completed, place the collected reaction product in a drying oven to dry, and obtain a graphe...
Embodiment 2
[0065] A graphene-gold bonding wire, comprising: 0.1% graphene, 0.0008% lanthanum, 0.0010% cerium, 70% gold, 29.898% silver, and the balance is unavoidable impurities.
[0066] The preparation method of above-mentioned graphene-gold bonding wire, comprises the following steps:
[0067] S21, prepare graphene-gold composite powder material:
[0068] Prepare AuCl with a concentration of 0.13mol / L 3 Aqueous solution 8L.
[0069] Graphene with a quality of 10g was placed in the prepared AuCl 3 In the aqueous solution, apply electromagnetic stirring and ultrasonic dispersion at the same time, adjust the pH value of the solution to 14 with ammonia water with a concentration of 30wt%, and drop in a formaldehyde reducing agent with a concentration of 30wt% under the condition of a reaction temperature of 60°C to 90°C Carry out reduction, rinse and filter with deionized water after the reaction is completed, place the collected reaction product in a drying oven to dry, and obtain a g...
Embodiment 3
[0093] A graphene-gold bonding wire, comprising: 0.90% graphene, 0.0010% lanthanum, 0.0100% cerium, 80% gold, 19.086% silver, and the balance is unavoidable impurities.
[0094] The preparation method of above-mentioned graphene-gold bonding wire, comprises the following steps:
[0095] S31, prepare graphene-gold composite powder material:
[0096] Prepare AuCl with a concentration of 0.15mol / L 3 Aqueous solution 10L.
[0097] Graphene with a quality of 15g was placed in the prepared AuCl 3 In the aqueous solution, apply electromagnetic stirring and ultrasonic dispersion at the same time, adjust the pH value of the solution to 13 with a concentration of 20wt% ammonia water, and drop in a formaldehyde reducing agent with a concentration of 40wt% under the condition of a reaction temperature of 60°C to 90°C Carry out the reduction, rinse and filter with deionized water after the reaction is completed, place the collected reaction product in a drying oven to dry, and obtain a ...
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