Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A method and a jig for manufacturing a pin-fin type power module

A power module and fixture technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problem of uneven pressure on insulating materials, cracking of insulating materials and pin-fin substrates, uneven external forces, etc. question

Pending Publication Date: 2020-08-11
ZF FRIEDRICHSHAFEN AG
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current manufacturing process has the following drawbacks: 1) The current transfer molding process requires a flat bottom to prevent epoxy from penetrating between the bottom mold and the bottom surface of the power module
2) When epoxy is injected, the pressure on the insulating material is uneven and the external force acting on each fin is also uneven, which may cause cracking and / or bending of the insulating material and the pin-fin substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method and a jig for manufacturing a pin-fin type power module
  • A method and a jig for manufacturing a pin-fin type power module
  • A method and a jig for manufacturing a pin-fin type power module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Example 1 :refer to Figure 4-Figure 8 , manufacture the pin-fin power module through the following steps:

[0024] First, a pin-fin type power module and a clamp 9 are provided. The power module includes a pin-fin substrate 1 , an insulating material (DBC) 2 connecting the substrate 1 , and a power chip 3 disposed on the DBC 2 . The substrate 1 has a first surface 11 and a second surface 12 opposite to the first surface 11 . The first surface 11 is connected to the DBC 2 and the second surface 12 has several fins 121 on it. The jig 9 includes a carbon body with a flat upper surface and a flat lower surface, and several through holes 91 are provided on the upper surface of the body, wherein the distribution of the through holes is the same as that of the fins, and the diameter of the holes is larger than the size of the fins. , and the length of the through hole is the same as the length of the fin.

[0025] Insert the pin-fin into the jig as Figure 6 As shown i...

Embodiment 2

[0028] Example 2 : now refer to Figure 9 to Figure 10 , in an alternative solution a stainless steel clamp 9 with a blind hole 91 is used. The blind holes are the same length as the fins. Before molding, all the fins 121 are inserted into the corresponding blind holes 91 by arrow A, and then the pin-fins are stably supported by the jig. The jig with blind holes is sufficiently stable that the pressure on the power module is evenly distributed during the molding process.

Embodiment 3

[0029] Example 3 : now refer to Figure 11 , in another alternative fixture, blind holes 91 are provided, but the length of the blind holes 91 is longer than the length of the fins 121, so there is a vertical gap 800 between each fin and the corresponding blind hole. The vertical direction is parallel to the length direction of the fins.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method and a jig for manufacturing a Pin-Fin type power module are disclosed. The method including: providing a Pin-Fin type power module and a jig, the power module comprises a Pin-Fin base plate,insulation material connecting the base plate and power chips provided on the insulation material, the jig includes a main body having a flat upper surface and a flat lower surface, and holes providedon the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins, inserting the Pin-Fin into the jig so each Fin is inside the corresponding hole, placing the power module combined with the jig in a cavity between a top mold and a bottom mold while the lower surface of the jig is placed on the upper surface of the bottom mold, performing the molding process by injecting epoxy resin, removing the jig from the Pin-Fin. The pressure is distributed uniformly during the epoxy resin molding since the flat surface is contacting the bottom mold, thus the insulation material and Pin-Fin cracking or bending can be avoided.

Description

technical field [0001] The present invention relates to a method and a jig for manufacturing a pin-fin type power module. Background technique [0002] refer to figure 1 , the pin-fin substrate 10 comprises a metal plate 11 with several fins 12 on one side (pin-fin side), and the other side (flat side) of the pin-fin substrate 10 is connected to the power module . The fins are in direct contact with the liquid cooling system, so the power module will not overheat. As a result, the thermal cycle capability of the power module is significantly improved and the life of the power module is extended. [0003] Traditional pin-fin power modules use silicone gel as the sealant. Such as figure 1 As shown in , in addition to the pin-fin substrate 10, the power module also includes an insulating material 20 (such as DBC (Direct Bonded Copper), polymer film) and a power chip 30 (IGBT, MOSFET, diodes, etc.). An insulating material 20 is attached to the flat side of the pin-fin sub...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L21/56
CPCH01L23/3677H01L21/565B29C45/14639B29C2045/14131B29C45/14065
Inventor 梁小广
Owner ZF FRIEDRICHSHAFEN AG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com