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Cushion pad for copper-clad plate laminating process and preparation method thereof

A technology of buffer pad and copper clad laminate, which is applied in the field of buffer pad and buffer pad preparation, can solve the problems of high cost, lack of buffering, product quality problems, etc., and achieve the effect of reducing cost

Pending Publication Date: 2020-08-14
青岛零频新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the buffer pads used in the prior art are made of wool or wool compressed felt material, which is very expensive, causing many manufacturers to choose to continue using the buffer pads beyond the time limit after the buffer pads reach their mission life, resulting in cracks in the buffer pads. Not only does it fail to act as a buffer, but it may also cause product quality problems

Method used

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  • Cushion pad for copper-clad plate laminating process and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0036] The buffer pad includes aluminum foil, silicone rubber layer, prepreg layer, silicone rubber layer, prepreg layer, silicone rubber layer and aluminum foil that are stacked in sequence. The silicone rubber layer contains chopped fibers and silicone rubber. The chopped fibers are Glass fiber, the surface of glass fiber is coated with silane coating, the weight of glass fiber is 10% of the weight of silicone rubber, wherein the thickness of each layer of aluminum foil is 0.1mm, the thickness of each layer of silicone rubber is 1mm, and each layer of prepreg The thickness of the layer is 0.3 mm. The preparation method is as follows: After laminating the aluminum foil, the silicone rubber layer doped with chopped fibers and the prepreg layer according to the set order, it is formed by heating and pressing with a hot press machine, and the pressure of the hot press machine is 50kg / cm 2 , the hot pressing temperature is 260°C.

[0037] The buffer pad of this embodiment has th...

Embodiment 2

[0040] The buffer pad includes aluminum foil, silicone rubber layer, prepreg layer, silicone rubber layer, prepreg layer, silicone rubber layer and aluminum foil that are stacked in sequence. The silicone rubber layer contains chopped fibers and silicone rubber. The chopped fibers are Aromatic polyamide fiber, the surface of the chopped fiber has a silane coating, the weight of the chopped fiber is 10% of the weight of the silicone rubber, wherein the thickness of each layer of aluminum foil is 0.2mm, and the thickness of each layer of silicone rubber is 2mm. The thickness of the impregnation layer is 0.1mm. The preparation method is as follows: After laminating the aluminum foil, the silicone rubber layer doped with chopped fibers and the prepreg layer according to the set order, it is formed by heating and pressing with a hot press machine, and the pressure of the hot press machine is 50kg / cm 2 , the hot pressing temperature is 260°C.

[0041] The buffer pad of this embodim...

Embodiment 3

[0044] The buffer pad includes aluminum foil, silicone rubber layer, prepreg layer, silicone rubber layer, prepreg layer, silicone rubber layer and aluminum foil that are stacked in sequence. The silicone rubber layer contains chopped fibers and silicone rubber. The chopped fibers are A mixture of glass fiber and ceramic fiber, the surface of the chopped fiber has a silane coating, the weight of the chopped fiber is 20% of the weight of the silicone rubber, wherein the thickness of each layer of aluminum foil is 0.1mm, and the thickness of each layer of silicone rubber is 1mm, The thickness of each prepreg layer is 0.3mm. The preparation method is as follows: After laminating the aluminum foil, the silicone rubber layer doped with chopped fibers and the prepreg layer according to the set order, it is formed by heating and pressing with a hot press machine, and the pressure of the hot press machine is 50kg / cm 2 , the hot pressing temperature is 260°C.

[0045] The buffer pad o...

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Abstract

The invention relates to the technical field of circuit board processing, in particular to a cushion pad for a copper-clad plate pressing process and a preparation method of the buffer pad. The cushion pad for the copper-clad plate laminating process comprises aluminum foils, a plurality of silicon rubber layers and prepreg layers, wherein the plurality of silicon rubber layers are positioned between the two layers of aluminum foils, every two adjacent silicon rubber layers are connected through the prepreg layers, the silicon rubber layers contain chopped fibers or ceramic fillers, the ceramic fillers contain metal oxides, and the prepreg layers are glass fibers coated with a plurality of layers of prepregs. According to the cushion pad and the preparation method thereof, the prepregs canbe materials which can be easily obtained on a production site by utilizing defective appearance products in the prepregs for a high-speed copper-clad plate, and the silicon rubber and chopped fibersin the prepregs are low-cost materials, so that the cost of the cushion pad is reduced.

Description

technical field [0001] The present application relates to the technical field of circuit board processing, in particular, to a buffer pad and a preparation method of the buffer pad used in the lamination process of copper-clad laminates. Background technique [0002] The hot press machine is the equipment used when the target product is used for press molding or hot pressing in the process of manufacturing printed circuit boards such as copper clad laminates, flexible printed circuit boards, and multilayer laminates. It is located between the upper and lower parts of the press plate of the heat press, so as to connect the upper and lower plates of the heat press. In order to prevent the impact of the pressure exerted by the upper and lower plates of the hot press, or the uneven pressure or the heat generated from causing defects in the objects located in the middle, it is necessary to paste a buffer on the upper and lower plates of the hot press. cushion. The material of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/06B32B15/20B32B17/02B32B17/06B32B25/20B32B37/06B32B37/10
CPCB32B5/02B32B15/06B32B15/20B32B25/10B32B25/20B32B37/06B32B37/10B32B2260/021B32B2262/0269B32B2262/101B32B2262/105B32B2262/106
Inventor 王海彬
Owner 青岛零频新材料科技有限公司