Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A wafer automatic sorting machine

An automatic sorting and wafer technology, applied in the direction of sorting, conveyor objects, electrical components, etc., can solve the problems of inability to sort substrate numbers, low sorting efficiency, easy sorting errors, etc., to save installation space, Improve sorting efficiency and place firmly

Active Publication Date: 2020-10-16
SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic wafer sorting machine to solve the problems of low sorting efficiency, inability to sort substrate numbers, and easy sorting errors existing in manual wafer sorting. and scratch wafer technical issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A wafer automatic sorting machine
  • A wafer automatic sorting machine
  • A wafer automatic sorting machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] The present invention will be further described below in conjunction with specific examples. However, the uses and purposes of these exemplary embodiments are only used to illustrate the present invention, and do not constitute any form of limitation to the actual protection scope of the present invention, nor limit the protection scope of the present invention thereto.

[0059] Such as Figure 1 to Figure 8 As shown, this embodiment provides an automatic wafer sorter, including a rack 1, a material rack 2, a wafer pick-and-place device, and a controller.

[0060] The material rack 2 is fixedly installed in the frame 1, and is used for placing flower baskets 36. The material rack 2 is divided into an area to be sorted and an area to be sorted. There are respectively flower basket positioning mechanisms corresponding to the placement positions of the flower basket.

[0061] The wafer pick-and-place device is arranged corresponding to the rack 2, including a mounting fr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of wafer production equipment and provides an automatic wafer sorting machine, which includes a frame, a material rack, a wafer pick-and-place device and a controller; the material rack is divided into an area to be sorted and a sorting completed area area, and are respectively equipped with a flower basket positioning mechanism corresponding to the placement position of the flower basket; the wafer pick-and-place device includes a mounting frame, and a mounting plate driven by the first driving device is installed on the mounting frame slidingly along the X-axis direction. The mounting seat driven by the second driving device and sliding along the Z-axis direction, the supporting plate driven by the third driving device is slidably installed on the mounting seat along the Y-axis direction, and the end of the supporting plate has a wafer holding part; the controller respectively It is connected with the flower basket positioning mechanism, the first driving device, the second driving device and the third driving device. Compared with the traditional artificial wafer sorting, the present invention not only greatly improves the sorting efficiency, effectively avoids sorting errors, does not cause scratches to the wafers, and can sort and place the substrate numbers of the sorted wafers.

Description

technical field [0001] The invention relates to the technical field of wafer production equipment, in particular to an automatic wafer sorter. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. In the process of wafer processing, due to external factors, the type and quality of the produced wafers will be different. Usually, the AOI test is carried out in the automatic optical inspection machine. After the type and quality of the wafer are detected, then according to the type and quality Different wafers are sorted to separate different wafers. During the inspection and sorting process of wafers, flower baskets are usually used to place, store, transport and transport wafers to simplify transportation and minimize the risk of contamination; in the sorting process, flower baskets are divided into flower baskets to be sorted and returned There are wafers ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677B07C5/02B07C5/34B07C5/36B07C5/38
CPCB07C5/02B07C5/3404B07C5/362B07C5/38H01L21/67259H01L21/67271H01L21/67742
Inventor 李凯杰赵成浩郭明灿臧运凤
Owner SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com