An improved patch equipment

Abstract

An improved patch equipment, including a body, a box body, a rack, a power device, a rotating shaft, a gear, a connecting column, a support plate, a positioning rod, a pressure plate, a spring, a patch suction head, electronic components, a heat conducting plate, and a load bearing Board and printed circuit board; slide rails are set in the body; the box body is slidably set on the slide rails; the power device is set on the box body; the bottom of the rotating shaft is rotationally connected with the box body; the gear and the rack are meshed; the rack is set on the slide rails The connecting column is set at the bottom of the box body; the support plate is horizontally set at the bottom of the connecting column; the bottom of the positioning rod is connected with the pressure plate; the spring sleeve is placed on the positioning rod; The bottom; the load-bearing plate is horizontally arranged in the body; the printed circuit board is placed on the load-bearing plate. In the present invention, the dust can be continuously sucked to prevent the dust from affecting the welding, and the pressing plate can be raised horizontally to prevent the electronic components from being crushed, and at the same time, the heat absorbed by the electronic components can be transferred out.

Description

technical field [0001] The invention relates to the technical field of placement equipment, in particular to an improved placement equipment. Background technique [0002] Patch is SMT patch, which refers to surface mount technology. It is a technology that mounts electronic components suitable for SMT production on printed circuit boards, and processes them into circuit boards equipped with electronic components through a certain process. It is a technology that will Surface mount components without leads or short leads are mounted on the surface of printed circuit boards or other substrates, and are soldered and assembled by reflow soldering or dip soldering. When soldering electronic components with many pins, the core of the electronic components will continue to absorb the heat transferred from the pins, which may cause the performance of the electronic components to degrade or even be damaged, and the existing chip placement equipment is prone to false soldering due to...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problems existing in the background technology, the present invention proposes an improved SMT equipment, which can continuously vacuum the electronic components before and during the welding process, and the positioning rod and the spring ensure that the pressure plate can rise while the pressure plate is horizontal, preventing Due to design problems, equipment precision, etc., the distance between the pressure plate and the load-bearing plate is too close to cause the electronic components to be crushed. At the same time, the heat absorbed by the electronic components during the welding process can be transferred out in time to prevent the performance of the electronic components from deteriorating or even failing.

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