Device and method for testing thermal fatigue of micro welding spot
A test equipment and thermal fatigue technology, which is applied in the field of micro-solder joint thermal fatigue test equipment, can solve the problems of cumbersome operation, low test efficiency, small temperature change rate range, etc., and achieve convenient operation, short test time and low cost Effect
Active Publication Date: 2020-08-18
NANCHANG HANGKONG UNIVERSITY
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[0004] The purpose of the present invention is to provide a thermal fatigue testing equipment and method for micro-solder joints to solve the problems of small temperature change rate range, cumbersome operation and low testing efficiency in traditional thermal fatigue testing methods
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] The object of the present invention is to provide a thermal fatigue testing equipment and method for micro-solder joints, so as to solve the problems of small temperature change rate range, cumbersome operation and low testing efficiency in traditional thermal fatigue testing methods.
[0033] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail...
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The invention discloses a device and a method for testing the thermal fatigue of a micro welding spot. The device comprises an induction heating system, a cooling system, a working platform and a temperature information monitoring system. The induction heating system and the cooling system are both connected with the temperature information monitoring system. The temperature information monitoringsystem monitors the temperature information of the working platform; when the temperature of the working platform rises to a high-temperature threshold value; the temperature information monitoring system closes the induction heating system and stops heating the working platform; meanwhile, a cooling system is started to cool the working platform; when the temperature information of the working platform is reduced to a low-temperature threshold value; the temperature information monitoring system closes the cooling system; according to the method, the micro welding spots can be automaticallyheated and cooled, the problems that a traditional thermal fatigue testing method is small in temperature change rate range, tedious in operation and low in testing efficiency are solved, and the method has the advantages of being convenient to operate, low in cost, short in testing time and high in efficiency.
Description
technical field [0001] The invention relates to the technical field of thermal fatigue testing, in particular to a testing device and method for thermal fatigue testing of micro solder joints. Background technique [0002] With the development of electronic packaging micro-connection technology towards miniaturization, high speed and integration, various new packaging technologies such as surface mount technology (Surface Mount Technology, SMT), ball grid array packaging technology (Ball GridArray, BGA) And chip-scale packaging technology (Chip Scale Package, CSP) has been widely developed and applied, and these packaging technologies are used to connect different materials and chips through micro-connection solder joints, so the micro-solder joints in the chip of electronic components It not only plays the role of mechanical support and signal transmission with the substrate, but also is an important way to dissipate heat in electronic components. Therefore, the performanc...
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IPC IPC(8): G01N3/60
CPCG01N3/60
Inventor 王善林吴鸣陈玉华尹立孟吴集思黄永德张体明谢吉林
Owner NANCHANG HANGKONG UNIVERSITY