Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Automatic ICT test device

A test device and automatic technology, applied in the direction of measuring device, electronic circuit test, measuring electricity, etc., can solve the problems of low automation, achieve high automation, reduce time cost, and ensure reliability

Active Publication Date: 2020-08-18
西安精雕软件科技有限公司
View PDF16 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide an automatic ICT test device to solve the problem in the prior art that the ICT test process is completed by manual operation and the degree of automation is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic ICT test device
  • Automatic ICT test device
  • Automatic ICT test device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0036] An embodiment of the present invention provides an automatic ICT testing device.

[0037] Principle description: The lifting mechanism 1 is integrally installed on the mechanism frame 2, and its function is to drive the probe fixture 3 to realize lifting and lowering. When it is raised, operations such as the replacement of the probe fixture and the placement, transmission, and adjustment of the circuit board fixture 4 can be carried out; The corresponding test points on the circuit board 43 are in contact, so as to realize the detection and programming of the circuit board 43 to be tested.

[0038] Such as figure 1 and 2As shown, the lifting mechanism 1 is fixed to the mechanism frame 2 through the leveling plate 18, and the leveling screw 15 is installed between the leveling plate 18 and the jig mounting plate 17, and its function is to adjust the level of the lifting mechanism 1 to make it compatible with the circuit board jig. The circuit board 43 to be tested on...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an automatic ICT test device, which comprises a lifting mechanism, a mechanism frame and a probe jig. The lifting mechanism is installed on the mechanism frame, and the probe jig is installed on the lifting mechanism. The probe jig is installed on the lifting mechanism, accurate positioning is achieved through the positioning pins, and different PCBs can be quickly replaced.A plurality of probes communicated with the ICT test instrument are installed in the probe jig, and the probes are distributed in one-to-one correspondence with the positions of test points on the PCB. And a positioning column is mounted on the probe jig and is used for accurately positioning the PCB circuit board jig. An air cylinder on the lifting mechanism can drive the probe jig to automatically ascend or descend, and when the probe jig ascends, the probe jig can be replaced; and when the probe jig descends, the probe is in contact with the measuring point, so that testing and program programming of the ICT test instrument on the PCB are realized.

Description

technical field [0001] The invention belongs to the technical field of test fixtures, and in particular relates to an automatic ICT test device. Background technique [0002] PCB is the core component of electronic products. In order to ensure the production quality of PCB in electronic products, ICT testing is generally performed on PCB before the product leaves the factory to detect the performance and connection of each component on the PCB, and to troubleshoot faults caused by manufacturing and welding defects. ICT testing is divided into flying probe ICT and needle bed ICT. Flying probe ICT has the characteristics of no need for test fixtures and short program development time, but the speed of single board testing is slow and is not suitable for mass product testing; in comparison , bed of needles ICT testing efficiency is high, suitable for batch product testing, more widely used in the field of electronic manufacturing. However, the traditional bed-of-needles ICT te...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/28G01R1/073
CPCG01R31/2806G01R1/073
Inventor 马劭航李修元平庆伟
Owner 西安精雕软件科技有限公司
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More