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Array substrate, display panel and method for preparing array substrate

An array substrate, horizontal plane technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as anode structure fracture, film cracking, and sub-pixel luminescence failure.

Active Publication Date: 2022-03-22
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the anode structure is subjected to stress, its film layer is very easy to crack. When the number of bending times reaches a certain upper limit, the anode structure will break, which will eventually lead to the failure of the corresponding sub-pixel to emit light.

Method used

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  • Array substrate, display panel and method for preparing array substrate
  • Array substrate, display panel and method for preparing array substrate
  • Array substrate, display panel and method for preparing array substrate

Examples

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Embodiment Construction

[0027] Such as Figure 1 to Figure 2 As shown, the array substrate 20 of an embodiment of the present invention includes: an anode 22, a pixel definition layer 24, an anode stress buffer layer 26 placed between the anode 22 and the pixel definition layer 24 and separating the anode 22 from the pixel definition layer 24 . The anode stress buffer layer 26 separates the anode 22 from the pixel defining layer 24 so that the anode 22 and the pixel defining layer 24 are not in contact with each other.

[0028] In this embodiment, a stress buffer layer is provided between the pixel definition layer and the anode, and the stress buffer layer completely separates the anode from the pixel definition layer, so that there is no contact between the anode and the pixel definition layer, so that the anode is subject to bending stress When , the stress buffer layer can protect the anode, decompose and absorb part of the stress. In this embodiment, without changing the original anode structu...

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PUM

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Abstract

A preparation method for an array substrate, a display panel, and an array substrate, comprising: an anode, a pixel defining layer, and an anode stress buffer layer placed between the anode and the pixel defining layer and separating the anode from the pixel defining layer; the above-mentioned array substrate, The preparation method of the display panel and the array substrate, by arranging the anode stress buffer layer between the anode and the pixel definition layer, absorbs the stress during the bending operation of the anode, avoids the concentration of stress on the anode, and at the same time connects the anode and the pixel through the anode stress buffer layer The limiting layer is separated to prevent the two from interfering with each other during bending, causing mutual influence, forming a secondary force impact on the stress, and at the same time preventing the pixel defining layer from transferring stress to the anode and causing the anode to be damaged due to secondary force.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an array substrate, a display panel and a method for preparing the array substrate. Background technique [0002] In recent years, flexible display technology has developed more and more rapidly, especially AMOLED (Active-matrixorganic light-emitting diode active-matrix organic light-emitting diode) flexible display is more and more widely used in terminals such as mobile phones, computers and TVs. There are many rigid film layers in AMOLED. These rigid film layers are tested at a certain radius and a certain speed in the flexible screen reliability bending test. Multiple bendings cause the rigid film layers to be subject to greater stress and cause fracture. When the anode structure is subjected to stress, its film layer is very easy to crack. When the number of bending times reaches a certain upper limit, the anode structure will break, and eventually the corresponding sub-pi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32H01L21/77
CPCH10K59/122H10K59/124H10K50/81H10K59/1201
Inventor 黄伟奇
Owner YUNGU GUAN TECH CO LTD
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