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Glue applying equipment for diode

A diode and equipment technology, applied in the field of diode gluing equipment, can solve problems such as affecting the smoothness of dispensing, reducing the amount of dispensing, dispensing, and wire drawing, so as to improve the efficiency of gluing and packaging, improve precision and quality, and speed up solidified effect

Active Publication Date: 2020-08-25
江西兰丰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The development of electronic equipment is changing with each passing day. Every household has a large number of electronic products. The indispensable electronic components in electronic products include diodes. A large part of the production efficiency of electronic diodes comes from the speed of dispensing. At present, the point of electronic components of diodes Glue equipment has the disadvantages of low dispensing efficiency and poor dispensing effect. During the dispensing work, there will be glue dripping and wire drawing, which will block the glue and affect the smoothness of dispensing glue, resulting in a reduction in the dispensing amount, or even no glue. Glue will seriously affect the precision and quality of dispensing, and it will also cause blisters after the glue on the surface of the diode solidifies, which will affect the lighting or use effect

Method used

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  • Glue applying equipment for diode
  • Glue applying equipment for diode
  • Glue applying equipment for diode

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Experimental program
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Effect test

Embodiment 1

[0027] see Figure 1-Figure 3 , the present invention provides a kind of diode gluing equipment, its structure comprises gluing machine 1, diode gluing template 2, electric controller 3, glue injecting device 4, sliding support 5, injecting head 6, described gluing machine 1 is provided with a diode gluing template 2 on the top surface, the gluing machine 1 and the diode gluing template 2 are slidingly fitted, the top of the gluing machine 1 is provided with a sliding bracket 5, and the gluing machine 1 It is movably connected with the sliding bracket 5, the front end of the sliding bracket 5 is provided with a glue injection device 4, the sliding bracket 5 is mechanically connected with the glue injection device 4, and the bottom of the glue injection device 4 is provided with a glue injection device. Head 6, the glue injection device 4 is connected with the glue injection head 6, and the electric controller 3 is installed on the left side of the sliding bracket 5.

[0028] ...

Embodiment 2

[0034] see Figure 1-Figure 5 , the present invention provides a diode gluing device, the glue injection head 6 is composed of a glue injection rod 6a, a fixed ring 6b, a spring 6c, a vibrating block 6d, and a limit ring groove 6e, and the surface of the glue injection rod 6a A fixed ring 6b is provided on the top, and the glue injection rod 6a is fixedly connected with the fixed ring 6b. A vibration block 6d is arranged under the bottom end of the glue injection rod 6a, and the glue injection rod 6a and the vibration block 6d pass through the spring 6c, the spring 6c is arranged on the surface of the glue injection rod 6a, and the inner top of the vibrating block 6d is provided with a limiting ring groove 6e.

[0035] A support ring 6a1 is provided on the surface of the glue injection rod 6a, and the glue injection rod 6a and the support ring 6a1 are an integrated structure.

[0036] A vibrating piece 6d1 is provided under the bottom of the vibrating piece 6d, and the vibrat...

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PUM

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Abstract

The invention discloses glue applying equipment for a diode. The glue applying equipment structurally comprises a glue applying machine, a diode glue applying mold plate, an electric controller, a glue injection device, a sliding support and a glue injection head. The diode glue applying mold plate utilizes sealing covers to damping the glue injection head and packaging glue for sealing protection, the situation that dust adheres to the surface of the glue, so that the packaging effect is influenced is avoided, the phenomenon of glue dripping or wire drawing of the glue injection head can be avoided, an auxiliary forming mechanism transfers heat energy through semicircular molds to conduct heat to heat and dry the glue, the solidification of the glue is accelerated, the glue applying packaging efficiency is improved, the diode element cannot be damaged due to the fact that the heat is separated from the semicircular molds, and a vibration block is driven by a spring to vibrate the sealing covers, so that vibration energy is transmitted to the semicircular molds through the sealing covers to extrude some bubbles existing in the glue in the semicircular molds out, the dispensing precision and quality are improved, and the bubbles are prevented from occurring in the packaged glue.

Description

technical field [0001] The invention relates to the field of diode processing, in particular to a diode gluing device. Background technique [0002] Glue dispensing is a process, also known as sizing, gluing, glue pouring, glue dropping, etc. It is to smear, fill, and drop electronic glue, oil or other liquids on the product, so that the product can stick and fill. Sealing, insulation, fixing, smooth surface and so on. [0003] The development of electronic equipment is changing with each passing day. Every household has a large number of electronic products. The indispensable electronic components in electronic products include diodes. A large part of the production efficiency of electronic diodes comes from the speed of dispensing. At present, the point of electronic components of diodes Glue equipment has the disadvantages of low dispensing efficiency and poor dispensing effect. During the dispensing work, there will be glue dripping and wire drawing, which will block th...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C9/14B05C13/02B05C11/08B05D3/02B05B15/50
CPCB05C5/0208B05C9/14B05C11/08B05C13/02B05D3/0254B05B15/50
Inventor 杨炳军
Owner 江西兰丰科技有限公司