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Preparation method of a breakdown-resistant epoxy resin-boron nitride composite material

A technology of epoxy resin and composite materials, applied in the direction of epoxy resin coating, coating, etc., can solve the problem of reducing the dielectric breakdown strength of epoxy resin, achieve improved breakdown resistance, strong controllability, and simple equipment Effect

Active Publication Date: 2021-11-02
NORTH CHINA ELECTRIC POWER UNIV (BAODING)
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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that boron nitride doped with micron particle size will reduce the dielectric breakdown strength of epoxy resin, and propose a breakdown-resistant epoxy resin-nitrogen by means of filler magnetization technology and magnetic field control curing technology. Preparation method of boron compound material

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  • Preparation method of a breakdown-resistant epoxy resin-boron nitride composite material
  • Preparation method of a breakdown-resistant epoxy resin-boron nitride composite material
  • Preparation method of a breakdown-resistant epoxy resin-boron nitride composite material

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Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, and the embodiments of the present invention are not limited thereto.

[0027] figure 1 Shown is the preparation process of epoxy resin-boron nitride composite material assisted by rotating magnetic field. First, carry out the surface activation treatment of boron nitride filler powder: weigh 10.0g flake hexagonal boron nitride powder, mix with 60mL absolute ethanol and 40mL deionized water, stir at room temperature for 30min, and continuously disperse in an ultrasonic cleaner 30min, obtain the boron nitride suspension; To it dropwise the 20% mass fraction aqueous solution of the polystyrene sulfonate sodium (PSS) of excessive 0.5g average molecular weight 70000, add dilute hydrochloric acid dropwise after continuous stirring 20min, wait for the solutio...

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Abstract

The invention discloses a method for preparing a breakdown-resistant epoxy resin-boron nitride composite material. The steps include: step 1, performing surface activation treatment on flake-shaped boron nitride fillers with micron particle diameters; step 2, using chemical Co-precipitation method, modifying nano-Fe on the surface of the filler 3 o 4 Particles to give them soft magnetic properties; Step 3, fully mix the treated filler powder with bisphenol A epoxy resin monomer and low-temperature curing agent at a mass ratio of 13.9:100:25, stir and vacuum degas , cured in a two-dimensional rotating magnetic field to obtain epoxy-boron nitride composites with filler tiled structures. The preparation method of the anti-puncture type epoxy resin-boron nitride composite material provided by the present invention can effectively improve its bulk phase breakdown strength, and the chemical treatment means and field control curing means adopted are suitable for batch preparation in industrial production, and In theory, this method is also applicable to improve the breakdown performance of composite materials doped with other polymers.

Description

technical field [0001] The invention relates to a preparation method of a breakdown-resistant epoxy resin-boron nitride composite material, belonging to the field of electrical materials. Background technique [0002] Boron nitride has a dielectric constant and electrical conductivity close to that of epoxy resin. Using it as a filler for insulating composite materials can effectively alleviate the local electric field distortion caused by conventional fillers such as alumina due to its high dielectric constant. At the same time, doping flake boron nitride can effectively improve the mechanical and thermal conductivity of epoxy resin, which makes it an ideal filler for next-generation composite insulating materials. However, studies have shown that doping boron nitride with micron particle size will reduce the dielectric breakdown strength of epoxy resin. The researchers attribute this to the breakdown-induced effect caused by the interfacial bonding of micron boron nitride ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D163/02C09D7/62
CPCC08K2003/385C09D163/00C09D7/62C08K9/10C08K3/38
Inventor 谢庆阮浩鸥律方成宋景萱詹振宇周华皓吴更腾
Owner NORTH CHINA ELECTRIC POWER UNIV (BAODING)