The utility model discloses a
silicon carbide MOSFET device comprising at least one
cell, and each
cell comprises a
silicon carbide substrate of a first
doping type; an epitaxial layer of a first
doping type; the well regions of the second
doping type are located in the epitaxial layer, and
JFET regions are arranged between the adjacent well regions; the source region of the first doping type is located in the well region; the
contact region of the second doping type is located in the well region and is adjacent to the source region; the
field oxide layer is located on the surface of the epitaxial layer and located above the
JFET region; the
gate oxide layer comprises a first
gate oxide layer and a second
gate oxide layer, and the first gate
oxide layer and the second gate
oxide layer are located on the two sides of the
field oxide layer respectively and are adjacent to the
field oxide layer respectively; the gate conductors comprise a first gate conductor and a second gate conductor, the first gate conductor covers the surface of the first gate
oxide layer and part of the surface of the field oxide layer, the second gate oxide layer covers the surface of the second gate oxide layer and part of the surface of the field oxide layer, and the first gate conductor and the second gate conductor are separated from each other.