290results about How to "Improve breakdown resistance" patented technology

The invention discloses a making method of double-mosaic structure, which comprises the following steps: making burying covering layer on the metal dielectric layer to form the metal dielectric layer and through-hole and groove in the burying covering layer; covering etching stopping layer on the substrate with metal pattern; covering the metal dielectric layer on the etching stopping layer; forming burying covering layer on the metal dielectric layer; etching the groove and through-hole to sediment metal through photoetching; making the meta dielectric layer surface protected by burying covering layer from damaging in the moving photoetching agent course of chemical mechanic grinding and plasma; improving the reliability of elements.

A semiconductor light emitting element of the present invention includes a support substrate, a semiconductor film including a light emitting layer, a surface electrode provided on the surface on a light-extraction-surface side of the semiconductor film, and a light reflecting layer. The surface electrode includes first electrode pieces that form ohmic contact with the semiconductor film and a second electrode piece electrically connected to the first electrode pieces. The light reflecting layer includes a reflecting electrode, and the reflecting electrode includes third electrode pieces that form ohmic contact with the semiconductor film and a fourth electrode piece electrically connected to the third electrode pieces and placed opposite to the second electrode piece. Both the second electrode piece and the fourth electrode piece form Schottky contact with the semiconductor film so as to form barriers to prevent forward current in the semiconductor film.

A semiconductor device includes a semiconductor substrate of a first conductivity-type, a buried diffusion layer of a second conductivity-type formed in the semiconductor substrate, a first well of the second conductivity-type having a bottom portion in contact with a top portion of the buried diffusion layer, the first well having an annular shape in a planar view, and a second well of the first conductivity-type formed to be surrounded by the first well. The semiconductor device further includes a diffusion region formed between a first portion of the second well and a second portion of the second well, the diffusion region having an impurity concentration lower than that of the second well, so that a depletion layer formed in the diffusion region can be provided, a transistor formed on the second well to function as an ESD (electro-static discharge) protection element, and an external terminal connected to a drain of the transistor.

A base mesa finger (an emitter ledge layer 15, a base layer 16, and a collector layer 17) is interposed between two collector fingers (collector electrodes 13), and on the base mesa finger, a base finger (a base electrode 12) and two emitter fingers (an emitter layer 14 and an emitter electrode 11) on both sides of the base finger, are formed. The two emitter fingers are formed symmetric with respect to the base finger as a reference.

The invention discloses an anti-static, anti-corrosion, waterproof and stretching-resistant insulated cable. The anti-static, anti-corrosion, waterproof and stretching-resistant insulated cable comprises a cable body. The cable body comprises cable cores, a cable core protective layer, an insulating layer, a shielding layer and an outer jacket. The cross section of the cable core protective layer is of a circular structure, and the multiple evenly-arranged cable cores are arranged in the cable core protective layer and separated through PVC plastic connecting rods; a plurality of current guide cores are arranged outside the cable core protective layer and are tangent with the cable core protective layer; the insulating layer is arranged outside the cable core protective layer; waterproof fillers are arranged in a gap between the insulating layer and the cable core protective layer; the shielding layer is tightly extruded on the insulating layer and internally provided with the multiple evenly-arranged current guide cores; a breakdown resistant layer, a steel core protective layer and a waterproof layer are sequentially extruded on the shielding layer from inside to outside; an armor layer is extruded outside the waterproof layer, the outer jacket is arranged outside the armor layer, and a graphite layer is arranged between the armor layer and the outer jacket. The anti-static, anti-corrosion, waterproof and stretching-resistant insulated cable has the advantages of being reasonable in structural design, high in anti-static capacity, good in anti-corrosion performance and the like.

The invention discloses a production method for a high-purity carbon black, which comprises the following steps: (Step 1) anthracene oil with a moisture content less than or equal to 0.2 percent and ethylene tar are sufficiently mixed according to the proportion of 8:2, and the mixed material is sequentially injected into a liquid pulverizer and an oil-residue separator and refined, so that refined material oil is obtained; (Step 2) natural gas and air are respectively filtered and then injected into the combustion chamber of a reaction furnace, wherein, after being filtered, the air is heatedto 900 DEG C, so that the temperature of the reaction furnace reaches 1800 DEG C to 2200 DEG C, wherein the refined material oil is heated to 250 DEG C to 300 DEG C, and the refined material oil andadditive are injected into a carbon black reactor of the reaction furnace to rapidly react for pyrolysis, so that the powdery carbon black is produced. The carbon black product produced by the invention has high purity and low ash, heavy metal, polycyclic aromatic hydrocarbon and sulfur contents, and can be highly dispersed to be completely combined with ingredients, the applicability, wear resistance, extrusion property, crack resistance, insulating property and conductivity of the product are increased, and the life of the product is greatly prolonged.

The invention provides a 3D NAND flash memory and a preparation method. The 3D NAND flash memory comprises a semiconductor substrate, a laminated structure, a channel through hole, a functional side wall and a channel layer, wherein the laminated structure is positioned on the semiconductor substrate, the laminated structure comprises inter-gate dielectric layers and grid layers which are superposed alternately; each inter-gate dielectric layer comprises first leakage inhibition layers and second leakage inhibition layers which are superposed alternately; the channel through hole is positionedinside the laminated structure; the functional side wall is positioned on the side wall surface of the channel through, the functional side wall comprises a plurality of separated storage units arranged along the depth direction of the channel through hole at intervals, and the storage units and the grid layers are arranged in a one-to-one correspondence mode; the channel layer is positioned inside the channel through hole, and is positioned on the surface of the functional side wall and the bottom of the channel through hole. According to the 3D NAND flash memory and the preparation method,electric leakage between adjacent grid layers can be reduced effectively, the breakdown resistance of the inter-gate dielectric layers between the adjacent grid layers is improved, and the coupling effect between the adjacent grid layers is reduced.

A field effect transistor includes a GaN epitaxial substrate, a gate electrode formed on an electron channel layer of the substrate, and source and drain electrodes arranged spaced apart by a prescribed distance on opposite sides of the gate electrode. The source and drain electrodes are in ohmic contact with the substrate. At an upper portion of the gate electrode, a field plate is formed protruding like a visor to the side of drain electrode. Between the electron channel layer of the epitaxial substrate and the field plate, a dielectric film is formed. The dielectric film is partially removed at a region immediately below the field plate, to be flush with a terminal end surface of the field plate. The dielectric film extends from a lower end of the removed portion to the drain electrode, to be overlapped on the drain electrode.

A manufacturing method for an SiC-based MOS device gate dielectric thin film comprises the steps that an SiC substrate is cleaned; an AlN thin film is deposited on the cleaned SiC substrate; the AlN thin film is oxidized into an AlxOyNz thin film, through oxidization technology control, the AlN thin film is oxidized into the AlxOyNz thin film completely or partially, and an AlN/AlxOyNz gate dielectric layer is formed; an Al2O3 thin film is deposited onto the AlxOyNz thin film to form an AlxOyNz/Al2O3 stacked gate dielectric layer and an AlN/AlxOyNz/Al2O3 stacked gate dielectric layer; argon annealing is conducted on the three obtained stacked gate dielectric layers; metal electrodes are sputtered or evaporated on the three annealed stacked gate dielectric layers to form an MOS device structure and manufacturing is completed. The gate dielectric thin film manufactured through the method has the advantages of being high in dielectric constant, low in interface state density, high in carrier migration rate and the like.

The invention discloses an LDMOS device with a multilayer super-junction structure. An active region of the device comprises a grid region, a source region and a drain region positioned on two sides of the grid region, a body region positioned under the grid region, and the multilayer super-junction structure positioned between the body region and the drain region, wherein the multilayer super-junction structure comprises at least two layers of super-junction structures arranged from bottom to top in turn; each layer of super-junction structure consists of n-type columnar regions and p-type columnar regions which are transversely and alternately arranged, preferably, the n-type columnar regions and the p-type columnar regions of upper and lower layers of super-junction structures are alternately arranged. The multilayer super-junction structure of the device can further improve the contact area among the n-type columnar regions and the p-type columnar regions, and simultaneously a method for manufacturing the structure cannot bring obvious side effects, so the anti-breakdown capacity of the device can be ensured to be higher than that of the conventional super-junction LDMOS device, and the multilayer super-junction structure also has high expansibility.

The invention discloses a lateral diffusion eGaN HEMT device integrating a reverse diode and an embedded drain electrode field plate. The device comprises a GaN buffer layer, an AlGaN barrier layer, agate electrode, an under-gate insulating layer, a source electrode, a source electrode extension section, a source electrode field plate, an MIS schottky diode extension section, an MIS schottky diode insulating layer, a p-type GaN or groove, a drain electrode, a passivation layer and an AlN staggered-layer drain electrode embedded field plate, wherein the MIS schottky diode insulating layer is prepared in the middle region, towards the MIS schottky diode extension section and the AlGAN barrier layer surface, of the source electrode field plate; the side, close to the drain electrode, of thediode adopts the p-type GaN or groove, so that the breakdown characteristic of the device is improved; the embedded staggered-layer field plate is adopted below the drain electrode, so that anti-breakdown capability of the drain electrode to the substrate is improved; the design of the staggered layer is suitable for the gradual change distribution of the drain electrode electric field from rightto left, so that the breakdown characteristic of the device is improved; and the source electrode field plate is extended, the gate electrode is wrapped, the MIS schottky diode is formed on the gate drain side, and the diode is made into a block isolation mode, so that the drain electrode current is greatly improved.

The invention discloses a radio frequency power amplifier with high linearity and high efficiency. The radio frequency power amplifier with high linearity and high efficiency comprises five capacitors: C1, C2, C3, C4 and C5, four resistances: R1, R2, R3 and R4, four N-channel metal oxide semiconductor (NMOS) pipes: M1, M2, M3 and M4 and two inductances: L1 and L2. Input radio frequency signals (Rfin) are respectively input to grids of the M1, M2 and M4 NMOS pipes through the C1, C2 and C3 capacitors, Vb1, Vb2, Vb3 and Vb4 bias voltages respectively provide direct current to the M1, M2, M3 and M4 NMOS pipes through the R1, R2, R3 and R4 resistances, drain electrode of the M2 NMOS pipe is connected with source electrode of the M4 NMOS pipe, and drain electrode of the M1 NMOS pipe is connected with source electrode of the M3 NMOS pipe. The radio frequency power amplifier with high linearity and high efficiency enhances puncture-resisting performance of a transistor, improves output power, and achieves high linearity and high efficiency of the power amplifier.

The invention discloses a structure of an electrostatic dedusting device. The structure is characterized by comprising a dust collection device, a fan device and a corona device, wherein the dust collection device is provided with dust collection plates which are distributed at intervals in an array mode; a single-way electric field and a dedusting air duct which traverses the electric field arranged between the adjacent dust collection plates; each dust collection plate comprises an insulation substrate and a conducting plate which is in close fit with the surface of the insulation substrate; by the fan device, air to be dedusted forms single-way controllable air flow, and the air flow penetrates through the dedusting air duct; the corona device is provided with a high-pressure emission head for electrifying dust particles in the air flow controlled by the fan device. According to the dedusting device with the structure, the dust collection plates comprise insulation substrates and conducting plates which are in close fit with the surfaces of the insulation substrates, so that the pneumatic design and electric field design of the dust collection device can be separated to avoid mutual influence; and resistance among the conducting plates is improved, and arcing is avoided, so that the optimized dedusting performance and the applicability on different occasions are realized finally.

The invention relates to a method for preparing (Ba, Sr) TiO3 nano powder by virtue of a Mg<2+> doped hydrothermal method. The method comprises the following steps: taking BaTiO3 powder and SrTiO3 powder which are synthesized by a hydrothermal method, adding water, mixing fully, then adding MgCl2, and mixing uniformly to obtain a mixed solution; and pouring the mixed solution into a hydrothermal kettle, preserving the heat at 120-180 DEG C for 4-8 hours to perform hydrothermal reaction, and performing centrifugal drying on a generated precipitate to obtain Mg<2+> doped (Ba, Sr) TiO3 nano powder. According to the method provided by the invention, the BaTiO3 powder and SrTiO3 powder which are prepared by the hydrothermal method are adopted as raw materials, then a minute quantity of MgCl2 is doped into the raw materials, and then the Mg<2+> doped (Ba, Sr) TiO3 powder is prepared by using the hydrothermal method under the condition that a mineralizer is not added, so that secondary reaction is effectively avoided, and the prepared powder is high in purity and uniform and meticulous in crystal grain, reaches a nano scale, and can effectively improve the energy storage characteristic and the breakdown resistance of ceramic when used for preparing the ceramic.

The invention provides breakdown-resistant insulating paint. The breakdown-resistant insulating paint is prepared by mixing emulsion A and emulsion B in a weight ratio of the mixing emulsion A to the emulsion B of 10:1, wherein the emulsion A comprises 30 to 60 parts of organic silicon modified epoxy resin, 50 to 80 parts of filler, 20 to 50 parts of mixed solvent, 5 to 20 parts of inorganic thickening agent, 5 to 10 parts of toughening agent, 5 to 15 parts of flame retardant and 5 to 15 parts of auxiliary flame retardant; and the emulsion B comprises 10 to 30 parts of curing agent and 10 to 30 parts of mixed solvent. One or more of mica powder, ceramic powder, aluminium hydroxide and quartz sand serves as the filler, so the breakdown-resistant insulating paint has excellent breakdown resistance. The breakdown-resistant insulating paint has high adaptability, excellent weather resistance and ageing resistance, excellent adhesion to various metal base materials, high solid content, lowvolume shrinking percentage when being dried and cured and high cracking resistance; and the breakdown-resistant insulating paint can be cured at normal temperature, so the breakdown-resistant insulating paint is simple, convenient, safe and reliable for application.

The invention discloses a seabed communication complex cable and a preparation method thereof. The seabed communication complex cable comprises a cable core, wherein the cable core is sleeved with a polyvinyl chloride water-blocking tape covering, a zinc-coated wire weaved shielding jacket and a cross-linking polyolefin projecting jacket in turn from outer to inner; the silica gel fills the gap between the cable core and the polyvinyl chloride water-blocking tape covering; the silica gel fills the gap between the zinc-coated wire weaved shielding jacket and the cross-linking polyolefin projecting jacket; the cable core comprises a first wire, a single mold optical fiber, a coaxial radio frequency cable and a second wire. The seabed communication complex cable prepared according to the method has excellent water resistance, electrical conductivity and breaking resistance. The preparation method has simple steps and is easy to popularize.

The invention discloses a highly-oriented arrangement core-shell structure fiber polyvinylidene fluoride-based composite medium and a preparation method thereof, wherein the composite medium is formedby compounding a core-shell structure BZCT@SiO2NFs filling phase and PVDF, the BZCT@SiO2NFs is a core-shell fiber structure, the core layer is barium calcium zirconate titanate, and the shell layer is silicon oxide. According to the present invention, an inorganic fiber filling phase having a large aspect ratio is prepared by using a sol-gel method and an electrospinning technology, the inorganicfiber filling phase is encapsulated with silica, the obtained material and PVDF are compounded, and quenching treatment is performed to obtain the dense highly-oriented one-dimensional core-shell structure inorganic fiber-PVDF-based composite film; and the highly-oriented arrangement one-dimensional core-shell structure inorganic fiber-PVDF-based composite film medium can significantly improve the dielectric property, the breakdown property and the energy storage property so as to maintain the excellent electrical insulation property and the mechanical properties of the polymer.