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Flat copper coil substrate with plurality of non-welding small holes and winding method

A winding method, copper coil technology, applied in the direction of transformer/inductor coil/winding/connection, transformer/inductor parts, inductor/transformer/magnet manufacturing, etc., can solve the problem of insufficient utilization of magnetic core window, magnetic core Can not be fully filled and other problems, to achieve the effect of reducing the overall height, reducing the number of layers, and reducing AC loss

Pending Publication Date: 2020-08-25
赵齐飞
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide a flat copper coil substrate with a plurality of small holes for non-welding purposes, aiming to solve the problems that the interior of the magnetic core cannot be fully filled and the utilization rate of the magnetic core window is insufficient in the prior art

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  • Flat copper coil substrate with plurality of non-welding small holes and winding method
  • Flat copper coil substrate with plurality of non-welding small holes and winding method
  • Flat copper coil substrate with plurality of non-welding small holes and winding method

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Embodiment Construction

[0038] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0039] like figure 1 and 2 As shown, the flat copper coil substrate with a plurality of small holes for non-welding purposes includes a porous flat copper coil substrate 2 formed with a gap 6 to form a non-closed structure, and the porous flat copper coil substrate 2 must be a copper-containing material; At least two outermost first through holes 1 for welding on the porous flat copper coil substrate 2; at least two second through holes 4 for non-welding purposes provided on the porous flat copper coil substrate 2, and The surroundings of the second through hole 4 are in a closed state, wherein there is at least one single-layer insulated coil (enameled wire, triple insulated coil, wire covered wire), preferably triple insulated wire, on the hole flat copper coil substrate 2 .

[0040] The present invention also includes the first notch 5 ...

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Abstract

The invention provides a flat copper coil substrate with a plurality of non-welding small holes and a winding method, and relates to the technical field of planar transformers. The flat copper coil substrate with the plurality of non-welding small holes comprises a porous flat copper coil substrate which is provided with a gap to form a non-closed structure, at least two first through holes whichare formed in the outermost side of the porous flat copper coil substrate and used for welding, and at least two second through holes which are formed in the porous flat copper coil substrate and used for non-welding, wherein the peripheries of the second through holes are in a closed state. According to the invention, the number of layers of the whole transformer winding is effectively reduced,and the cost is reduced; a plurality of strands of thin insulated wires can be adopted to replace a single thick insulated wire, so that the internal space of the magnetic core is fully filled; and multi-path output can be easily achieved on the primary side and the secondary side of the transformer at the same time.

Description

technical field [0001] The invention relates to the technical field of planar transformers, in particular to a flat copper coil substrate with multiple small holes for non-welding purposes and a winding method. Background technique [0002] Planar transformers are generally used in high-frequency, high-efficiency, small-volume, and low-height occasions, and are most often seen in low-voltage input communication DCDC products. However, the traditional planar transformer structure has many shortcomings in the case of high voltage input and multiple outputs. When high voltage is input, the primary side of the planar transformer is generally composed of a wire cake composed of triple insulated wires, and the secondary is composed of a flat copper coil substrate. The most typical disadvantages are as follows: [0003] 1. When the winding adopts a mixed structure of insulated wires and substrates, it is generally impossible to simply provide multiple outputs for both primary and ...

Claims

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Application Information

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IPC IPC(8): H01F27/28H01F27/30H01F41/064
CPCH01F27/2871H01F27/306H01F41/064
Inventor 赵齐飞
Owner 赵齐飞
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