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A new film forming process for aluminum-based copper clad laminates

A technology of aluminum-based copper-clad laminates and molding processes, which is applied in the direction of controlled lamination, other household appliances, chemical instruments and methods, and can solve problems such as low production efficiency

Inactive Publication Date: 2021-02-26
SHENZHEN CHUANGHUI ALLIANCE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a new aluminum-based copper-clad laminate coating forming process, which is used to solve the problems of the current copper plate coating forming process: independent manual cutting process, manual leveling process, manual film coating process, and low production efficiency. question

Method used

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  • A new film forming process for aluminum-based copper clad laminates
  • A new film forming process for aluminum-based copper clad laminates
  • A new film forming process for aluminum-based copper clad laminates

Examples

Experimental program
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Effect test

Embodiment 1

[0093] The embodiment of the present invention provides a new aluminum-based copper clad laminate film forming process, such as Figure 1-3 As shown, including sequentially:

[0094] Step 1: The aluminum substrate 81 is sent to the positioning device 1 for positioning;

[0095] Step 2: The positioned aluminum substrate 81 is sent to the dust removal device for dust removal;

[0096] Step 3: The aluminum substrate 81 after dust removal is sent to the automatic film coating device 9 for film coating;

[0097] Step 4: The coated aluminum substrate 81 is sent to the automatic leveling device 4 for leveling;

[0098] Step 5: The flattened aluminum substrate 81 is sent to the automatic cutting device 5 for cutting to form the finished aluminum substrate 8 .

[0099] Such as figure 2 As shown, the finished aluminum plate 8 includes: a protective film 82, an aluminum plate 811, and an adhesive copper 812 arranged sequentially from bottom to top;

[0100] Such as image 3 As sho...

Embodiment 2

[0111] Such as figure 1 Shown, on the basis of described embodiment 1:

[0112] The automatic leveling device 4 includes: a horizontal leveling device 41 and a longitudinal leveling device 42; the automatic cutting device 5 includes: a horizontal positioning cutting device 51 and a longitudinal positioning cutting device 52;

[0113] The step 4 includes: horizontal leveling by the horizontal leveling device 41, and then after being turned by the first steering device 6, it is sent to the longitudinal leveling device 42 for longitudinal leveling; preferably, the first steering device and the second The second steering device is a steering roller;

[0114] The step 5 includes: the aluminum substrate 81 after longitudinal leveling is turned by the first turning device 6, then transferred to the horizontal positioning and cutting device 51 for horizontal positioning and cutting, and then sent to the longitudinal positioning and cutting device 52 for longitudinal positioning cut....

Embodiment 3

[0117] On the basis of embodiment 1 or 2, such as Figure 4 As shown, the positioning device 1 includes:

[0118] Fixing seat 11;

[0119] Several triangular prisms 12 are movably installed on the fixed seat, and the several triangular prisms 12 are symmetrically arranged on both sides of the aluminum substrate 81, and the tips of the triangular prisms 12 face the aluminum substrate 81;

[0120] The driving device 13 is connected with the triangular prism 12, and is used to drive the tip of the triangular prism 12 close to the aluminum substrate to position the aluminum substrate; preferably, the driving device is an electric cylinder (or an electrohydraulic or pneumatic cylinder) or an electric cylinder. The telescopic rod is used to drive the triangular cylinder to move in a straight line;

[0121] The chute 111 is arranged on the top of the fixing seat 11;

[0122] The slider 14 is fixedly connected to the non-point end of the bottom end of the triangular prism 12 , and ...

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Abstract

The present invention provides a novel film-coated forming process for aluminum-based copper clad laminates, comprising: step 1: transferring the aluminum substrate to a positioning device for positioning; step 2: transferring the positioned aluminum substrate to a dust-removing device for dust removal; step 3: removing the aluminum substrate after dust removal The substrate is transferred to the automatic laminating device for lamination; Step 4: The laminated aluminum substrate is transferred to an automatic leveling device for leveling; Step 5: The leveled aluminum substrate is transported to an automatic cutting device for cutting to form a finished aluminum plate. The invention realizes the lamination process, leveling and cutting into a complete automatic process by automatically transferring the aluminum substrate to the automatic laminating device, the automatic leveling device and the automatic cutting device in sequence. The invention reduces the need for manual labor. efficient. In addition, a positioning device is installed before lamination to avoid deviation; and dust removal is performed before lamination to avoid direct lamination without dust removal. The protective film is easy to absorb dust and debris due to the electrostatic effect, and the die-cutting plate forming is easy to crush the aluminum surface. scrapped.

Description

technical field [0001] The invention relates to the technical field of aluminum-based copper-clad laminate forming technology, in particular to a novel aluminum-based copper-clad laminate forming process. Background technique [0002] At present, the forming of aluminum-based copper clad laminates on the market is three independent processes, and the three processes cannot be perfectly combined. This process is to cut and shape first, then level it, and finally coat it. This kind of cutting is relatively neat. , but the film cannot be fully automatic; in addition, first leveling, and then manually repairing the cutting film, has the defects of time-consuming and low efficiency. [0003] Now on the market, after the aluminum-based copper-clad laminate is pressed and cured, there are copper skins and heat-conducting adhesive on the four sides of the metal substrate. When the film is directly coated, the protective film is easy to absorb dust and debris due to the electrostatic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/00B32B38/00B32B38/16B32B41/00H05K3/02
CPCB32B37/0007B32B37/10B32B38/0004B32B38/162B32B41/00B32B2041/04B32B2457/08H05K3/022
Inventor 吴国庆江奎何新荣叶鹏飞
Owner SHENZHEN CHUANGHUI ALLIANCE TECH