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Test method for high frequency leadless ceramic enclosures with a pitch of 0.5mm

A technology of ceramic shell and test method, which is applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of deterioration of microwave performance, low impedance of side hollow holes, etc., and achieves good grounding, Good impedance matching, the effect of suppressing resonance

Active Publication Date: 2022-04-01
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
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  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a high-frequency leadless ceramic housing with a pitch of 0.5 mm, aiming to solve the problems of low impedance at the hollow hole on the side and deterioration of microwave performance caused by resonance

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  • Test method for high frequency leadless ceramic enclosures with a pitch of 0.5mm
  • Test method for high frequency leadless ceramic enclosures with a pitch of 0.5mm
  • Test method for high frequency leadless ceramic enclosures with a pitch of 0.5mm

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Embodiment Construction

[0039] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0040] Please also refer to Figure 1 to Figure 5 , the high-frequency leadless ceramic housing with a pitch of 0.5mm provided by the present invention is now described. The 0.5mm pitch high-frequency leadless ceramic housing includes a housing 1, the outer surface of the housing 1 is provided with a metallized hollow hole, and the back of the housing 1 is provided with a grounding pad 6 and a radio frequency pad 7. The front of the housing 1 is provided with a sealing area 5, the metallized hollow hole has a diameter of 0.2 mm, and the metallized hollow hole incl...

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Abstract

The invention provides a test method for a high-frequency leadless ceramic shell with a pitch of 0.5 mm, which belongs to the technical field of ceramic packaging. Metallized hollow holes are arranged on the outer surface of the shell, and the diameter of the metallized hollow holes is 0.2 mm. The holes include grounding hollow holes and radio frequency lead-out hollow holes. The ground hollow holes are arranged through the height direction of the outer surface of the shell; the radio frequency lead-out hollow holes extend into the cavity of the shell; The through-pad, the sealing area is connected to the ground pad through the through-pad through the ground hollow hole; the pitch between the through-pad and the RF pad is 0.5mm. The 0.5mm pitch high-frequency leadless ceramic shell and testing method provided by the present invention can achieve good impedance matching at the hollow hole; and the metallized hollow hole on the side is directly connected to the sealing area to ensure the sealing area. Good grounding to suppress resonance.

Description

technical field [0001] The invention belongs to the technical field of ceramic packaging, and more specifically relates to a testing method for a high-frequency leadless ceramic shell with a pitch of 0.5 mm. Background technique [0002] Foreign plastic-encapsulated leadless housings usually have a pitch of 0.50mm. Take the QFN (QuadFlat No-leadPackage, Quad Flat No-lead Package) evenly arranged around the square terminal as an example, see Table 1. [0003] Table 1 Common dimensions and number of pins of foreign plastic-encapsulated QFN devices [0004] Dimensions The total number of terminals Number of terminals on one side pitch QFN16 3×3 16 4 0.50mm QFN24 4×4 24 6 0.50mm QFN32 5×5 32 8 0.50mm QFN40 6×6 40 10 0.50mm [0005] If the pads are replaced in situ, the ceramic housing pads must still maintain a 0.50mm pitch, while the conventional hollow hole diameter is 0.25mm, see Figure 8 to Figure 10 , due to th...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/31H01L21/66H01L23/544
CPCH01L23/3107H01L23/49506H01L22/14H01L22/32H01L2224/48091H01L2924/00014
Inventor 王轲乔志壮刘林杰
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP