Interconnection structure assembly and millimeter wave antenna assembly

Abstract

The invention provides an interconnection structure assembly and a millimeter wave antenna assembly. The interconnection structure assembly comprises a circuit board and two transmission lines, wherein the circuit board comprises at least two stacked electric conducting layers, the two transmission lines are arranged on the circuit board and located on different electric conducting layers, the atleast two electric conducting layers include a first electric conducting layer and a second electric conducting layer, the two transmission lines are respectively a first transmission line located onthe first electric conducting layer and a second transmission line located on the second electric conducting layer, and the interconnection structure assembly further comprises electric conducting holes arranged on the circuit board in a penetrating manner and electrically connected with the first transmission line and the second transmission line, and a plurality of metal buried holes arranged onthe circuit board, surrounding the electric conducting hole and used for shielding the electric conducting hole. According to the interconnection structure assembly, the metal buried holes used for shielding the electric conducting holes are formed around the electric conducting holes electrically connected with the first transmission line and the second transmission line in the surrounding modeto shield the electric conducting holes, so that leakage of transmission signals is reduced, and energy loss of the transmission signals in the transmission process of the interconnection structure assembly is reduced.

Description

technical field [0001] The present invention relates to the technical field of communication, in particular to an interconnection structure component and a millimeter wave antenna component. Background technique [0002] With the development of science and technology, communication base stations are developing towards high frequency, broadband, and miniaturization, and millimeter wave antennas are gradually developing towards microstrip antennas and beamforming array antennas. With the miniaturization of the millimeter-wave base station, the millimeter-wave beamforming array microstrip antenna and the millimeter-wave chip are integrated on different sides of the same board, and the two are connected through a vertical interconnection structure. The interconnection structure can simplify the connection structure. . [0003] The existing millimeter-wave band vertical interconnection methods are mainly: Figure 1a and Figure 1b , a first transmission line 2 and a second tran...

AI Technical Summary

Problems solved by technology

However, when using this vertical interconnection structure, as the frequency increases to millimeter wave, as the integration level of the base station increases and the number of conductive layers increases, the length of the vertical interconnection structure also increases, resulting in more obvious parasitic effects. The transmission loss of some vertical interconnect structures in the millimeter wave frequency band is too large to meet the requirements of use

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