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Flux and Paste

一种助焊剂、溶剂的技术，应用在焊接设备、焊接介质、焊接/切割介质/材料等方向，能够解决失球、焊料球错位、无法确保软钎料湿润性等问题，达到低残渣、抑制残渣的量的效果

Active Publication Date: 2022-02-25
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In addition, in soldering using solder balls, if the wettability of the solder is not ensured, the solder will not spread evenly on the electrodes, and the position of the solder balls will be misaligned with respect to the electrodes, resulting in missing balls. subject

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0066] The fluxes of Examples and Comparative Examples were prepared with the compositions shown in Tables 1 and 2 below, and the wetting and spreading properties of solder, retention of solder balls, and amount of residue were verified. In addition, the composition rate in Table 1 and Table 2 excludes the ratio of isobornylcyclohexanol, and the whole amount of flux was set as 100 wt (weight)%.

[0067]

[0068] (1) Verification method

[0069] Print the fluxes of each embodiment and each comparative example on a Cu plate with a diameter of φ0.34mm and a thickness of t=0.2mm, and then mount Ag as 3wt%, Cu as 0.5wt%, and the remainder as a solder of Sn ( Sn-3Ag-0.5Cu) formed solder balls. The diameter of the solder ball is φ0.3mm. The number of evaluation objects was 50 in each Example and each Comparative Example. Using a reflow oven, the N 2 Under the atmosphere, the test object prepared as above was heated from 25° C. to 250° C. at a heating rate of 5° C. / second, and t...

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Abstract

We provide low-residue fluxes that ensure solder wettability, secure solder ball retention, suppress the amount of residue after soldering, and are suitable for use without cleaning. The flux contains: an organic acid mixture formed of an organic acid with a carbon number of 10 or more by weight of 1 wt% to 15 wt%, isobornyl cyclohexanol from 50 wt% to 90 wt%, other solvents from 5 wt% to 45 wt%, When the total of isobornylcyclohexanol and other solvents is 100 wt%, the ratio of isobornylcyclohexanol is 50 wt% or more and 95 wt% or less, and the organic acid mixture composed of an organic acid having 10 or more carbon atoms is composed of 2‑Methylazelaic acid, 4‑(methoxycarbonyl)‑2,4‑dimethylundecanedioic acid, 4,6‑bis(methoxycarbonyl)‑2,4,6‑trimethyl tridecanedioic acid and 8,9‑bis(methoxycarbonyl)‑8,9‑dimethylhexadecanedioic acid.

Description

technical field [0001] The present invention relates to a flux used in soldering and a solder paste using the flux. Background technique [0002] In general, the flux used in soldering has the effect of chemically removing the metal oxide existing on the soldering material and the metal surface of the soldering object to be joined, and the metal element can be mixed between the two. Boundaries move. Therefore, by performing soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be joined, and a strong joint can be obtained. [0003] In recent years, along with the development of small information equipment, electronic components to be mounted have been rapidly reduced in size. Among electronic components, a ball grid array package (BGA) in which electrodes are arranged on the rear surface is used in order to cope with the reduction in the size of connection terminals and the reduction in mounting area due t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/26C22C13/00
CPCB23K35/26C22C13/00B23K35/025B23K35/362B23K35/365B23K35/262B23K35/3613
Inventor 川中子知久平冈美幸西崎贵洋川崎浩由白鸟正人
Owner SENJU METAL IND CO LTD