Stirring equipment for preparing alkoxy high-end capped electronic potting glue

Abstract

An alkoxy high end-capped electronic potting glue preparation mixing equipment, comprising a box, a first support plate, a rope, a guide rod, a rotating rod, a nut, a mixing barrel, a second support plate, a connecting rod, a first The gear, the first rotating shaft, the first power device, the third support plate, the stirring rod and the controller; the electronic scale is arranged in the box; the bottom of the rope is connected with the pull ring, and the top of the rope is wound around the rotating rod; one end of the rotating rod is provided with The first limit plate, the other end of the rotating rod is provided with a rocking handle; the mixing bucket is placed on the first support plate; the second support plate is connected with the connecting rod; the connecting rod is connected with the inner wall of the box; the first gear is connected with the outer periphery of the second support plate The bottom of the stirring rod extends into the stirring barrel, and the top of the stirring rod is provided with a second limit plate; the controller is set on the outside of the top of the box body. In the present invention, the electronic potting glue can be automatically stirred to make it evenly mixed, and at the same time, the glue on the stirring rod can be scraped off.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a stirring device for preparing an alkoxy high-end capped electronic potting glue. Background technique [0002] Electronic potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance, and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the roles of waterproof, moisture-proof, dust-proof, insulation, heat conduction, sealing, corrosion resistance, temperature resistance, and shock resistance. When using electronic potting glue, it is necessary to mix and stir component A silica gel and component B curing agent evenly before using it. Stir in one direction during the stirring process, and the speed should be uniform. The existing electronic potting glue is in When stirring, the user manually stirs through t...

AI Technical Summary

Problems solved by technology

When using electronic potting glue, it is necessary to mix and stir component A silica gel and component B curing agent evenly before using it. Stir in one direction during the stirring process, and the speed should be uniform. The existing electronic potting glue is in When stirring, the user manually stirs through the stirring rod, which is time-consuming and laborious, and manual stirring is likely to cause inconsistent stirring directions and inconsistent stirring speeds, resulting in a large number of air bubbles in the mixed electronic potting compound. Automatic defoaming in minutes, but the larger the dosage, the faster the component reaction will lead to faster curing of the electronic potting adhesive, and the standing process time will seriously affect the use effect, so it is necessary to minimize the air bubbles mixed in the mixing process; at the same time, the manual stirring is over Finally, the stirring rod is directly taken out, and a large amount of electronic potting adhesive is directly brought out on the surface of the stirring rod, resulting in a change in the actual ratio of components A and B, which will also affect the curing effect of the electronic potting adhesive, and the electronic potting adhesive is bring out a lot of waste

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