Laser exposure process for lead wire frame

Abstract

The invention discloses a lead wire frame laser exposure process, and belongs to the technical field of film pressing equipment. The process is characterized by comprising the following steps of: 1) pressing dry films (11) on two sides of a lead wire frame (9) through a film pressing device; 2) matching an input roller (3) with a winding roller (5) to enable the lead wire frame (9) to maintain tension of 10-20 kg, driving optical engines (2) on the two sides of the lead wire frame (9) to move by a translation device, and exposing the dry films (11) on the two sides of the lead wire frame (9);and 3) driving the optical engines (2) by the translation device to expose the next position of the lead wire frame (9) until the exposure of the whole roll of lead wire frame (9) is completed. According to the laser exposure process for the lead wire frame, the input roller is matched with the winding roller, so that the tension of the lead frame is maintained to be 10-20 kg, the lead wire framecan be ensured to be straightened, and the damage to the lead wire frame can be avoided.

Description

technical field [0001] A laser exposure process for a lead frame belongs to the technical field of lamination equipment. Background technique [0002] Lead frame is the basic material of semiconductor packaging and the carrier of integrated circuit chips. The main material for producing lead frame is copper alloy, which is mainly produced by stamping. After stamping, the lead frame needs to be etched to achieve high density and multi-pin Production of several lead frames. [0003] The basic principle of the etching process is to use the photosensitive properties of the chemical photosensitive material to form an anti-etching mask on the copper strip, and to etch away part of the metal through the corrosive solution to obtain the desired product. The mask is divided into dry film and wet film. When the dry film is used, it is usually pressed on the copper belt by a film laminating machine. The existing film laminating machine usually presses the dry film on the On the coppe...

AI Technical Summary

Problems solved by technology

The mask is divided into dry film and wet film. When the dry film is used, it is usually pressed on the copper belt by a film laminating machine. The existing film laminating machine usually presses the dry film on the On the copper strip, but because the copper strip and the dry film need to be at a certain temperature and reach a certain pressing time to be firmly bonded, in order to ensure that the dry film and the copper strip reach the specified temperature, a certain amount of extrusion between the dry film and the energized The time required to reduce the conveying speed of the copper strip, if the conveying speed of the copper strip is too fast, there will be a problem that the bond between the dry film and the copper strip is not strong

The working efficiency of the existing laminating machine is very low, and the qualified rate of the product is low

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