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Sputtering processing and apparatus

A sputtering and retaining ring technology, applied in the field of auxiliary sputtering ball grid array IC units, can solve the problems of lack of support, misalignment of units, etc., and achieve the effect of avoiding extra cost and maintaining structural support

Pending Publication Date: 2020-09-11
ROKKO SYST PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The difficulty with using tape without pattern support is that the flexibility of the tape tends to misalign the unit and lack adequate support during shipping

Method used

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  • Sputtering processing and apparatus
  • Sputtering processing and apparatus
  • Sputtering processing and apparatus

Examples

Experimental program
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Effect test

Embodiment Construction

[0015] Thus, the present invention provides a reusable template having an array of wells corresponding to IC units. The method starts by inspecting, flipping, aligning and orienting the unit. The inspection, alignment and orientation steps include: performing a top view inspection; then moving the unit to a flipper and then a picker to align the unit. By securing the stencil to the sputtering station, the IC unit is transferred directly to the sputtering station to be positioned on a laser cut tape bonded to a retaining ring which in turn is placed on the stencil. After the sputtering method, the unit is ejected, aligned and further inspected before being unloaded.

[0016] Figure 1A and Figure 1B The preparation of the retaining ring 10 prior to laser cutting the holes is shown. The ring 10 houses a double-sided sputtering tape 15 covering the space in the ring 10 . Sputtering tape 15 may be an adhesive layer applied to the retaining ring. A lower layer, such as sub-ta...

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PUM

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Abstract

A process for sputtering a plurality of integrated circuit (IC) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each ICunit corresponding to an aligned aperture and recess; and then applying a sputtering process to the IC units engaged with the holding ring.

Description

technical field [0001] The present invention relates to the processing of integrated circuit (IC) cells, and in particular to methods and apparatus for assisting in the sputtering of ball grid array (BGA) IC cells. Background technique [0002] Sputtering to deposit thin films of materials on IC cells is an effective method of applying materials with very high melting points. Therefore, sputtering has been widely used due to its flexibility to the applied materials. [0003] Typically, an array of IC units is placed on a substrate and passed through a sputtering chamber to receive a thin layer of material. [0004] In doing so, the IC unit is supported by a stencil adhesively bonded to the ring with double-sided tape. The double-sided tape is laser cut, with the IC units fitted in the holes created by the laser cutting. The stencil with the IC unit is then removed and sent for sputtering. The units are then ejected and removed from the system. [0005] However, the use ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683C23C14/34C23C14/50
CPCH01L21/6836H01L21/67011C23C14/50C23C14/34H01L2221/68313H01L2221/6834H01L2221/6835
Inventor 丁锺才申允锡张德春
Owner ROKKO SYST PTE LTD