Punchless rivetless connection device and method combined with multi-energy field

Abstract

The present invention provides a multi-energy field composite punchless rivetless connection device and method. A groove is provided, a tapered protrusion is provided in the middle of the die, the top of the die is provided with a first sheet metal and a second sheet metal; Above the second metal sheet, a ring-shaped binder coil is embedded in the binder ring. The multi-energy field composite non-punching type rivetless connection device and method of the present invention does not need to use a punch, and by organically unifying the magnetic field, electric field, and plastic mechanics field, and the joint action of multiple fields, four The two ring-shaped mechanical lock structures of the solder joints improve the microstructure, improve the material flow during the rivetless joint process, reduce the stress concentration on the neck of the rivetless joint, and significantly improve the mechanical properties of the joint, with high reliability and efficiency Higher and easier to operate.

Description

technical field [0001] The invention relates to the technical field of plate connection, in particular to a punchless rivetless connection device and method combined with multi-energy fields. Background technique [0002] In recent years, with the development of aerospace, transportation, and electronics, lightweight materials and lightweight structures have received extensive attention. The joining process of lightweight materials is becoming more and more popular. [0003] The traditional rivetless connection process uses a special punch and lower die to stamp the same or different materials, so that the materials are hooked and connected together. Although the rivetless connection has low cost and low energy consumption, it does not produce harmful However, in the process of stamping, with the increase of stamping times, the punch gradually wears out. When the wear of the punch reaches a certain level, it will seriously affect the strength and dimensional accuracy of the...

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a multi-energy field compound non-punching type rivetless connection device and method, the purpose of which is to solve the need to use a punch for the non-rivet connection, the punch will wear after repeated use, and the punch will wear to a certain When the level is too high, it will affect the strength and dimensional accuracy of the processed joints. The strength of the riveted connection structure is not high, the stress state of the joints is unreasonable, there is stress concentration in the neck of the joints, and there are problems of cracking defects.

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