Method for quickly counting chip-type scattered components

Abstract

The invention discloses a method for quickly counting chip-type scattered components. The method comprises the following steps that a plurality of chip-type scattered components are placed on an object carrying platform; a bottom light source on the carrying platform is turned on; an industrial camera of the image recognition system is controlled to photograph, and an original image of the chip-type scattered components on the carrying platform is obtained; the image recognition system sends the original image to a computer and carries out graying and binarization processing to obtain a processed image; and the computer obtains the average area of each independent chip-type scattered component and the total area of the plurality of chip-type scattered components according to the processedimage and the set area characteristic range information of the single material, and the number obtained by dividing the total area by the average area is used as the counting result of the chip-type scattered electronic components. The counting efficiency and the counting quality of the chip-type scattered components are improved, the counting recording function is also achieved, the waste of manual counting cost and time cost is greatly reduced, and great benefits are brought to the improvement of production and manufacturing productivity.

Description

technical field [0001] The invention relates to the field of electronic assembly, in particular to a method for quickly counting chip-type scattered components. Background technique [0002] Component counting and counting is a necessary step before materials are produced, especially for external tasks, the completeness and accuracy of materials are a necessary guarantee for the effective implementation of production. Combined with the actual production, the inventory of chip scattered devices is a bottleneck that seriously affects the production efficiency of the current electrical equipment industry, especially for military electronic products, the chip devices used must be secondarily screened by designated agencies. The original specification The packaged sheet-like devices were all in a scattered state. In terms of storage, the materials are not packaged in a standardized way and are not arranged in an orderly manner, which makes it impossible to quickly and effectivel...

AI Technical Summary

Problems solved by technology

This method uses the image recognition operation of industrial cameras to achieve counting and automatic labeling for scientific research. However, this method has to eliminate the trays that do not meet the counting requirements, and has relatively large constraints. At the same time, its goal is to count the remaining materials on the tray, which is not applicable. in bulk operation

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