Substrate cutting method of optical module
An optical module and cutting method technology, applied in metal processing, electrical components, electrical solid devices, etc., can solve the problem of sticky debris and impurities on the surface of glue, reduce the generation of debris and impurities, and ensure normal use. Effect
Inactive Publication Date: 2020-09-18
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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Problems solved by technology
[0003] The main purpose of the present invention is to propose a method for cutting the substrate of an optical module, aiming at solving the technical problem that the surface of the glue is easy to stick debris and impurities when cutting the substrate of the optical module
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[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0041] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
[0042] In addition, if there are descriptions involving "first", "second" and ...
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Abstract
The invention discloses a substrate cutting method of an optical module, which comprises the following steps of providing a substrate loaded with the optical module, wherein the optical module comprises a shell and a component and the component is encapsulated in the shell through a pouring sealant, adding a surfactant into cutting water of a cutting machine, and carrying out film sealing treatment on the adhesive surface of the optical module to form a layer of active agent film on the adhesive surface, debugging cutting parameters of the cutting machine, and cutting the substrate according to the cutting parameters after the substrate is wetted by the cutting water so as to separate the optical modules on the substrate. The surfactant is added into the cutting water of the cutting machine, a layer of active agent film is formed on the adhesive surface, the substrate is cut after being completely wet by the cutting water, so that the cutting water forms an active agent film on the adhesive surface before formal cutting, scrap impurities generated in the subsequent cutting process are prevented from adhering to the surface of the pouring sealant, and meanwhile, the scrap impuritiesgenerated in the cutting process of the substrate are reduced by debugging cutting parameters of a cutting machine.
Description
technical field [0001] The invention relates to the technical field of optical module processing, in particular to a method for cutting a substrate of an optical module. Background technique [0002] Optical modules, such as the heart rate module, are devices used to measure the heart rate of the human body. Commonly used optical modules monitor the heart rate of the human body through photoelectric projection measurement, that is, the skin is illuminated by LED lights. Absorption, each time the heart pumps blood, the wavelength is heavily absorbed, allowing the heartbeat to be determined. In practical applications, heart rate modules are generally installed inside devices such as wristbands and watches to monitor heart rate following human movement. However, due to the large range of motion of the wearer, the components in the heart rate module, In particular, LED devices are prone to drop or damage. Therefore, heart rate products or LED products in the industry need potti...
Claims
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IPC IPC(8): H01L25/16B26D5/00B26D7/34
CPCB26D5/00B26D7/34B26F2210/08H01L25/167
Inventor 孙恺王德信孙艳美汪奎
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD