Manufacturing method of rigid-flex board
A technology for a flexible-rigid bonding board and a manufacturing method, which is applied to the exposure method of radiation-sensitive masks, printed circuit manufacturing, laminating printed circuit boards, etc. , poor opening and other problems, to achieve the effect of protecting from being bitten by the potion and mechanical wear, ensuring the quality and ensuring the smoothness
Inactive Publication Date: 2020-09-18
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0009] Aiming at the above-mentioned existing technical defects, the present invention provides a method for making a soft-rigid combination board. By adopting this method, the problems of milling damage to the soft board caused by excessive depth control or poor opening caused by insufficient depth control can be avoided. The non-pressing of the cover film and PP leads to the problem that the soft and hard joints are not firmly bonded, and the bending process is easy to tear
Method used
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Embodiment
[0032] This embodiment provides a method for making a rigid-flex board, and the specific process is as follows:
[0033] (1) Cutting: According to the panel size of 520mm×620mm, the soft board core board and the hard board core board are cut out. The thickness of the soft board core board is 0.075mm, and the thickness of the outer copper foil is 0.5OZ. The soft board core board includes The soft board area and the soft-hard combination area; the thickness of the hard board core board is 0.2mm, and the thickness of the outer copper foil is 0.5OZ.
[0034] (2), inner layer circuit production (negative film process): inner layer graphics transfer, use vertical coating machine to coat photosensitive film, the film thickness of photosensitive film is controlled to 8μm, adopt automatic exposure machine, with 5-6 grid exposure ruler ( 21-grid exposure ruler) to complete the exposure of the inner layer circuit on the soft board core board and the hard board core board respectively; th...
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The invention discloses a manufacturing method of a rigid-flex board. The manufacturing method comprises the following steps: respectively manufacturing inner-layer circuits of a flexible board core board and a rigid board core board; wherein the soft board core board comprises a soft board area and a soft and hard combination area; attaching a covering film to the soft board area on the soft board core board in an aligned mode; cutting the periphery, corresponding to the soft board area, of the hard board core board through by laser, so that the waste part needing to be uncovered in the laterperiod is separated from the hard board core board; pressing the soft board core board and the hard board core board into a production board by using non-gummosis PP, placing the waste material parton the original position of the hard board core board for pressing together during pressing, windowing the non-gummosis PP corresponding to the soft board area, and enabling the size of the windowingto be smaller than the sizes of the waste material part and the soft board area; and sequentially carrying out subsequent processes and uncovering on the production board to remove the cut-through waste material part, thereby obtaining the rigid-flex board. By the adoption of the method, the problem that a soft board is damaged by milling or uncovering is poor in the later period can be solved, and meanwhile the problems that bonding of soft and hard combination positions is not firm, and tearing is prone to occurring in the bending process are solved.
Description
technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing a rigid-flex board. Background technique [0002] Rigid-flex boards, also known as rigid-flex boards, are composed of rigid hard boards and flexible soft boards that are selectively laminated together. Its structure is compact and metallized holes form conductive connections. Rigid-flex boards take into account the rules and toughness of conventional hard boards and the flexibility and flexibility of soft boards. They can be moved, bent, folded, twisted, and realize three-dimensional wiring, which greatly saves the installation space of electronic components and conforms to the "lightweight" design of electronic products. The development trend of "thin, short and small" has been widely used in military industry, aerospace, automotive electronics, medical electronics, civilian consumer electronics and many other fields in the...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0047H05K3/0058H05K3/0082
Inventor 黄望望寻瑞平何淼吴家培覃红秀
Owner JIANGMEN SUNTAK CIRCUIT TECH