PGA packaging microwave test fixture

Abstract

The invention relates to a PGA packaging microwave test fixture. The PGA packaging microwave test fixture comprises a test panel and a PGA packaging test socket arranged on the test panel. The end face of the PGA packaging test socket is provided with a PGA slot and circuit connecting devices. The circuit connecting devices are symmetrically and uniformly arranged on the end surface of the PGA packaging test socket. A connector is arranged on the bottom surface of the test panel. The end face of the PGA packaging test socket is also covered with a fixed clamping piece of which the opening sizeis consistent with that of the PGA slot. The size of the PGA slot is a multiple of 1.27mm. The PGA packaging microwave test fixture developed by the invention has the following advantages: 1, a PGA chip can be tested in a plugging mode, the chip is not damaged, and random errors are reduced; 2, the test end surface and the calibration end surface are unified, so that the measurement accuracy is improved; and 3, the connector is positioned on the back surface of the PGA packaging socket, so that the length of a micro-strip line is reduced, and the precision of a measurement result is improved.

Description

technical field [0001] The invention relates to the technical field of radio frequency microwave chips, in particular to a PGA packaging microwave test fixture. Background technique [0002] With the rapid development of radio frequency microwave technology, all kinds of radio frequency chips are widely used in aerospace, modern communication systems and military fields. The performance test of radio frequency microwave chips is an important link in chip design, production and application. [0003] Based on the traditional method, the chip is welded on the input microstrip line and the output microstrip line on the chip carrier. This method is not easy to disassemble and is easy to damage the chip; the measurement uncertainty and random error introduced by repeated welding and disassembly are large; the test The end face and the calibration end face are not on the same end face, causing the calibration data of the test equipment to be different from the data of the test end ...

AI Technical Summary

Problems solved by technology

[0003] Based on the traditional method, the chip is welded on the input microstrip line and the output microstrip line on the chip carrier. This method is not easy to disassemble and is easy to damage the chip; the measurement uncertainty and random error introduced by repeated welding and disassembly are large; the test The end face and the calibration end face are not on the same end face, causing the calibration data of the test equipment to be different from the data of the test end face of the device under test, introducing measurement errors

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