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High-precision forming method for VCM flexible circuit board

A technology of flexible circuit boards and forming methods, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as low die-cutting accuracy, low dimensional accuracy, and unsatisfactory products, so as to improve die-cutting accuracy and strength , shrink the effect of shrinkage

Active Publication Date: 2020-09-25
WUXI HAOBANG HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a high-precision molding method for VCM flexible circuit boards, so as to solve the problems of low FPC machining dimensional accuracy, low die-cutting accuracy, and products that cannot meet the assembly requirements of VCM components proposed in the background technology.

Method used

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  • High-precision forming method for VCM flexible circuit board
  • High-precision forming method for VCM flexible circuit board
  • High-precision forming method for VCM flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A VCM flexible circuit board high-precision forming method, the specific operation method is:

[0042] Step 1. Provide FPC flexible board assembly 1, and perform FPC single product processing on FPC flexible board assembly 1;

[0043] The FPC flexible board panel 1 includes a panel body 101, the panel body 101 is provided with an effective area 102 and an invalid area 103, and the effective area 102 is provided with four, and the four effective areas 102 are arranged in a matrix, The invalid area 103 is distributed in a cross shape;

[0044] A plurality of FPC items 3 arranged in a matrix are arranged in the effective area 102, and one side of the FPC items 3 is provided with an optical positioning point 104;

[0045]The invalid area 103 adopts a full-panel normal mode structure;

[0046] A plurality of positioning holes 105 are arranged in the invalid area 103;

[0047] Step 2. Perform SMT patching on multiple FPC single products on the entire FPC flexible board pan...

Embodiment 2

[0063] The difference between this embodiment and Embodiment 1 is that the FPC flexible board panel 1 in step 1 includes a panel body 101, and the panel body 101 is provided with an effective area 102 and an invalid area 103, and the effective area There are six 102, and the six effective areas 102 are arranged in a matrix, so that the invalid areas 103 are distributed in a well shape.

[0064] The difference between the above-mentioned FPC flexible board assembly (including six effective areas, each with 2×4 matrix-arranged FPC items) and the original FPC flexible board assembly (8×16 matrix-arranged FPC items) The comparison table of expansion and contraction coefficient and process capability index (cpk) is as follows:

[0065] Panel specification Expansion coefficient Process Capability Index 6×(2×4) ±0.029 1.4 8×16 ±0.048 0.3

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Abstract

The invention discloses a high-precision forming method for a VCM flexible circuit board. The specific operation method is as follows: step 1, providing an FPC flexible board jointed board, performingFPC single product processing on the FPC flexible board jointed board; the FPC flexible board jointed board comprising a jointed board body, a plurality of effective areas and a plurality of invalidareas being arranged on the jointed board body, the plurality of effective areas being arranged in a matrix, so that the invalid areas are distributed in a cross shape or a # shape, and a plurality ofFPC single products arranged in the matrix are arranged in the effective areas; step 2, performing SMT pasting on the plurality of FPC single products on the whole jointed board; step 3, performing operations such as dispensing and electrical property detection on the plurality of FPC components of the whole jointed board; fourthly, the whole jointed board is punched into a single product througha punching die; step 5, loading into a tray. The method has the advantages that the FPC machining size precision is improved, the die cutting precision is high, and the assembling requirement of theVCM assembly can be met.

Description

technical field [0001] The invention belongs to the technical field of cell phone camera module production, and in particular relates to a high-precision molding method for a VCM flexible circuit board. Background technique [0002] With the development of camera phones to high pixel, it began to ask for auto focus function. Generally speaking, users expect autofocus in camera phones with more than 2 megapixels. However, according to the traditional method, the focus function will greatly increase the size of the circuit board and the thickness of the mobile phone. In today's era, the pursuit of short, light and thin electronic products is becoming more and more demanding. Therefore, high-precision VCM has become the best choice for mobile phone camera modules. VCM (Voice Coil Moto), commonly known as a voice coil motor or a voice coil motor, is used to adjust the position of the lens to make the camera show the clearest state. It has the advantages of small footprint on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0052H05K2203/0228
Inventor 张巧杏鲍云峰袁野符爱风
Owner WUXI HAOBANG HIGH TECH CO LTD
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