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Conformal countercurrent liquid cooling radiator

A radiator and countercurrent technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of large thickness of liquid-cooled radiators, insufficient temperature uniformity, unsatisfactory structure, etc. The effect of improving space utilization and good temperature uniformity

Active Publication Date: 2020-10-09
XIDIAN UNIV +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the technical problems of existing liquid-cooled radiators, such as large thickness, insufficient temperature uniformity, and unsuitable structure for electronic equipment with curved surfaces, the purpose of the present invention is to provide a conformal counter-flow liquid-cooled radiator, which can solve the problem of conformal basis with electronic equipment. On, effectively guarantee the uniformity of its temperature

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  • Conformal countercurrent liquid cooling radiator
  • Conformal countercurrent liquid cooling radiator
  • Conformal countercurrent liquid cooling radiator

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Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with accompanying drawing

[0024] refer to figure 1 , figure 2 , image 3 , Figure 4 and Figure 5

[0025] A conformal counter-flow liquid cooling radiator of the present invention comprises a cover plate 1, a partition plate 2, and a base plate 3, and is characterized in that the cover plate 1, the partition plate 2, and the base plate 3 are conformal to the electronic equipment; the cover plate The plate 1 is located on the top of the conformal counterflow liquid cooling radiator; the partition plate (2) includes a confluence channel 2.1, a diversion channel 2.2, a counterflow channel 2.3, a transverse channel 2.4, and a longitudinal channel 2.5; the base plate 3 includes an inlet joint 3.1 and Two identical outlet joints 3.2; the confluence channel 2.1 is located directly below the outlet joint 3.2 and communicates with the outlet joint 3.2; the longitudinal channel 2.5 is located...

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Abstract

The invention discloses a conformal countercurrent liquid cooling radiator. The conformal countercurrent liquid cooling radiator comprises a cover plate, a partition plate and a substrate, wherein thecover plate, the partition plate, the substrate and electronic equipment are conformal; the cover plate is positioned at the top of the conformal countercurrent liquid cooling radiator; the partitionplate comprises a converging channel, a flow dividing channel, a countercurrent channel, a transverse channel and a longitudinal channel; the base plate comprises an inlet connector and an outlet connector; the converging channel is located under the outlet connector; the longitudinal channel is located under the inlet connector; the flow dividing channel is located above the converging channel and staggered with the converging channel; and the countercurrent channel is composed of a left flow channel, a right flow channel, a flow channel layering opening and a flow channel liquid dividing opening, and such a structure enables cooling media in the left flow channel and the right flow channel to flow in opposite directions. The conformal countercurrent liquid cooling radiator can be used as a liquid cooling radiator of curved-surface electronic equipment, and has the advantages of small thickness, good temperature uniformity and good comprehensive heat dissipation performance.

Description

technical field [0001] The invention belongs to the technical field of thermal management of electronic equipment, and in particular relates to a conformal counterflow liquid cooling radiator among liquid cooling radiators, which can be applied to heat dissipation of electronic equipment. Background technique [0002] With the rapid development of integrated circuits and electronic materials, the heat flux of electronic components has risen sharply, and the problem of thermal management of electronic equipment has become more prominent. Common heat dissipation methods for electronic equipment include natural cooling, forced air cooling, and cold plate liquid cooling. Natural heat dissipation has low cost and low failure rate, but it is only suitable for equipment with small heat consumption; forced air cooling is to fix the heating device on the radiator, and when the cold air passes through the radiator, the heat is taken away to realize convective heat exchange; cold plate...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20218H05K7/20272
Inventor 周金柱刘德荣王梅王平安康乐黄进
Owner XIDIAN UNIV
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