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Bonding gold strip and preparation method therefor
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A technology of alloy strip and gold strip, applied in electrical components, circuits, electric solid devices, etc., can solve the problems of low strength, unable to meet the bonding requirements, poor solderability, etc., achieve high current resistance, improve mechanical properties, connection solid effect
Active Publication Date: 2020-10-13
上杭县紫金佳博电子新材料科技有限公司
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Problems solved by technology
However, the gold ribbon processed only by pure gold is very soft, has low strength, poor solderability, and cannot meet the bonding requirements.
Method used
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Embodiment 1
[0026] A bonding gold ribbon, its composition and content (percentage by weight) are as follows: Au 99.9984%, Be 0.0003%, Cu 0.0003%, Fe 0.0003%, Mg 0.0003%, Ag 0.0003% and other impurities 0.001%.
[0027] The preparation method of the bonding gold ribbon is as follows, the target size is: 0.125mm (width) × 0.0125mm (thickness):
[0028] (1) Put gold into the continuous casting furnace, then add trace elements Be, Cu, Fe, Mg and Ag, melt at 1200°C (1150-1250°C is acceptable), and cast gold rods.
[0029] (2) Use a wire drawingmachine to draw the gold rod and process it into a gold wire of φ0.0453mm. The diameter tolerance of the gold wire is controlled to be ±0.0003mm; the elongation rate of the mold during the wire drawing process is 8% to 15%, and the wire drawing speed is 7 to 10m / s.
[0030] (3) Roll the gold wire with a special precision rolling mill for gold strips (gold strip calender KPS-Y4), and process it into a gold strip of the target size. The width tolerance ...
Embodiment 2
[0034] A bonding gold ribbon, its composition and content (percentage by weight) are as follows: Au 99.9979%, Be 0.0006%, Cu 0.0004%, Fe 0.0003%, Mg 0.0003%, Ag 0.0005% and other impurities 0.001%.
[0035] The preparation method of the bonding gold ribbon is the same as that of Example 1.
Embodiment 3
[0037] A bonding gold ribbon, its composition and content (percentage by weight) are as follows: Au 99.9971%, Be 0.0009%, Cu 0.0005%, Fe 0.0003%, Mg 0.0003%, Ag 0.0009% and other impurities 0.001%.
[0038] The preparation method of the bonding gold ribbon is the same as that of Example 1.
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Abstract
The invention discloses a bonding gold strip and a preparation method therefor. The bonding gold strip comprises the following components of, in percentage by weight, 99.99% < / = Au < 100%, 0 < Be < / =0.001%, 0 < Cu < / = 0.003%, 0 < Fe < / = 0.001%, 0 < Mg < / = 0.001% and 0 < Ag < / = 0.003%. According to the method, the formula of the bonding gold strip is optimized, and thus the mechanical property ofthe bonding gold strip is remarkably improved, and the bonding gold strip has proper tensile strength and elongation and meets the bonding requirement. The bonding gold strip prepared through the method is stable and reliable in transmission, high in current withstanding, firm in connection, and high in size precision, the width tolerance is + / -1%, the thickness tolerance is + / -0.0002 mm, and thegold strip belongs to high-precision products.
Description
technical field [0001] The invention belongs to the technical field of bonding materials, and in particular relates to a bonding gold ribbon and a preparation method thereof. Background technique [0002] Bonding is an important step in the production of integrated circuits, an operation that connects circuit chips to lead frames. Both the bonding gold ribbon and the bonding gold wire are inner leads used for electrical connection between the input / output bonding points of the on-chip circuit and the inner contact points of the lead frame during the assembly of semiconductor devices and integrated circuits. However, the effect of bonding gold ribbon and bonding gold wire is different. Due to the current skin effect, gold wires and gold ribbons with the same cross-sectional area can bear different currents, and the maximum current that gold ribbons can withstand is much higher than that of gold wires. Especially in the military industry, the battlefield environment is speci...
Claims
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