Integrated uniform temperature plate and manufacturing method thereof

A vapor chamber and one-piece technology, applied in the field of heat dissipation technology, can solve the problems of difficult processing, cumbersome welding and sealing process, peeling or falling off of the upper shell and the lower shell, etc., to control the leakage problem, solve the problem of easy peeling or Shedding effect

Pending Publication Date: 2020-10-13
惠州惠立勤电子科技有限公司
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Problems solved by technology

[0004] However, although the above-mentioned vapor chamber has heat conduction efficiency, there are the following problems in actual use, because the sealing length between the upper casing and the lower casing almost covers each part of the upper casing and the lower casing The length of the side makes the process of welding and sealing quite cumbersome and difficult to process. In addition, during the process of welding an

Method used

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  • Integrated uniform temperature plate and manufacturing method thereof
  • Integrated uniform temperature plate and manufacturing method thereof
  • Integrated uniform temperature plate and manufacturing method thereof

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Embodiment Construction

[0034] The detailed description and technical content of the present invention are described below with the drawings, but the drawings are only for reference and illustration, and are not intended to limit the present invention.

[0035] see Figure 6 As shown, the present invention provides a kind of integral type vapor chamber manufacturing method, and its method step comprises:

[0036] a) forming a housing base material and a plurality of cooling fin materials connected to the housing base material by drawing or extruding, and forming a cavity A inside the housing base material;

[0037] b) Carrying out a segmental cutting process on the housing base material and each of the cooling fin materials, and forming an opening at the first and last ends of the cavity A;

[0038] c) Perform a press-fit sealing process on each of the segmented openings, and form a sealing portion 30 respectively; and

[0039] d) Filling a working fluid 40 into the cavity A and applying a degassin...

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Abstract

The invention discloses an integrated uniform temperature plate and a manufacturing method thereof. The uniform temperature plate comprises a shell base, cooling fins, a sealing part and working fluid. The shell base is formed in a drawing or extruding mode and comprises a bottom plate, a top plate and side plates, and a containing cavity is formed among the bottom plate, the top plate and the side plates in a surrounding mode; each radiating fin is formed by extending from the surface, back to the bottom plate, of the top plate. The sealing parts are respectively formed at the head end and the tail end of the accommodating cavity. The working fluid is arranged in the containing cavity. Therefore, the integrated uniform temperature plate disclosed by the invention is easy to manufacture and has a good heat dissipation effect.

Description

technical field [0001] The invention relates to a heat dissipation technology, in particular to an integrated vapor chamber and a manufacturing method thereof. Background technique [0002] As the calculation speed of electronic components continues to increase, the heat generated by them is also increasing. In order to effectively solve the problem of high heat generation, the industry has widely used Vapor Chambers with good thermal conductivity , but there is still room for improvement in the existing vapor chambers in terms of thermal conductivity, manufacturing cost, and manufacturing ease. [0003] A common temperature chamber mainly includes an upper shell and a lower shell, and a capillary structure is respectively installed in the inner space of the upper shell and the lower shell, and then the upper shell and the lower shell are welded together , and then fill the working fluid into the upper shell and the lower shell, and finally perform degassing sealing and oth...

Claims

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Application Information

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IPC IPC(8): H05K7/20F28D15/04
CPCF28D15/046H05K7/20336
Inventor 林俊宏
Owner 惠州惠立勤电子科技有限公司
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