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Grinding device for controlling grinding surface shape of wafer

A technology for controlling wafers and grinding surfaces, applied to grinding/polishing equipment, parts of grinding machine tools, grinding racks, etc., which can solve the problem of difficulty in ensuring surface shape accuracy, surface shape accuracy requirements are difficult to guarantee, and processing effects To achieve accurate control, improve processing effect and manufacturing quality

Pending Publication Date: 2020-10-16
华海清科(北京)科技有限公司
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Problems solved by technology

At the same time, in order to increase the output of IC chips and reduce the unit manufacturing cost, the diameter of the wafer tends to be larger. However, the increase in the size of the wafer will easily cause warping and deformation of the wafer, and the surface accuracy requirements are not easy to guarantee, resulting in poor processing effect.
[0003] Using the existing technology to thin the wafer will easily cause the thickness of the wafer to be uneven, and it is difficult to ensure the accuracy of the surface shape, which will affect the subsequent process

Method used

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  • Grinding device for controlling grinding surface shape of wafer
  • Grinding device for controlling grinding surface shape of wafer
  • Grinding device for controlling grinding surface shape of wafer

Examples

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Embodiment Construction

[0041] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions. It should be understood that, unless otherwise specified, for ease of understanding, the following descriptions of the specifi...

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Abstract

The invention discloses a grinding device for controlling grinding surface shape of a wafer. The grinding device comprises a workbench, sucker turntables, a measuring unit and an angle adjusting device; the workbench is used for supporting a plurality of sucker turntables; the sucker turntables are used for holding the wafer and driving the wafer to rotate; the measuring unit is used for measuringthe thickness of the wafer to obtain the grinding surface shape of the wafer; and the angle adjusting device is used for adjusting the sucker turntables, and the angle adjusting device is connected with the sucker turntables to adjust the angle of inclination of the sucker turntables in at least two directions so as to adjust the grinding surface shape of the wafer. According to the grinding device for controlling the grinding surface shape of the wafer, accurate control of the grinding surface shape of the wafer can be controlled, and the processing effect and the manufacturing quality of the wafer are improved, and therefore technical guarantee for the stacking process of ultra-high-density semiconductors is provided.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer processing, in particular to a grinding device for controlling the grinding surface shape of a wafer. Background technique [0002] At present, the semiconductor industry manufactures semiconductor chips by forming electronic circuits such as IC (Integrated Circuit) or LSI (Large Scale Integration) on the surface of semiconductor wafers. Before the wafer is divided into semiconductor chips, the wafer is thinned to a predetermined thickness by grinding the back surface opposite to the device surface on which the electronic circuit is formed by a grinding processing apparatus. Grinding the backside of the wafer can reduce the volume of the chip package and reduce the height of the package mounting. The thickness of the chip after the backside thinning can even reach less than 5% of the initial thickness. At the same time, in order to increase the output of IC chips and reduce the unit m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/22B24B41/06B24B41/02B24B49/12B24B49/00B24B47/22
CPCB24B19/22B24B41/02B24B41/06B24B47/22B24B49/00B24B49/12
Inventor 王江涛刘远航赵德文路新春马旭
Owner 华海清科(北京)科技有限公司
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