Variable-interval adsorption device and multi-axis motion adsorption device and method

Abstract

The invention discloses a variable-interval adsorption device and a multi-axis motion adsorption device and method. The variable-interval adsorption device comprises a linear motion mechanism and a multi-stage shear fork mechanism which are located on the same straight line; the end, close to the linear motion mechanism, of the multi-stage shear fork mechanism is fixedly arranged, and the end, away from the linear motion mechanism, of the multi-stage shear fork mechanism is connected with the output end of the linear motion mechanism; a middle cross point of each stage of the multi-stage shearfork mechanism is connected with one end of a connecting rod, and multiple connecting rods are arranged in parallel; and first pneumatic joints and suckers are arranged at the other ends of the connecting rods, and the suckers communicate with the first pneumatic joints. According to the variable-interval adsorption device and multi-axis motion adsorption device and method, multiple workpieces can be transported at the same time, and intervals of the workpieces are changed in the workpiece adsorption process so as to adapt to different-interval placement of the workpieces.

Description

technical field [0001] The invention belongs to the field of mechanical automation, and relates to a variable pitch adsorption device, a multi-axis motion adsorption device and a method. Background technique [0002] With the design of electronic products becoming smaller, lighter and thinner, electronic products are developing towards high-density integration and ultra-fine. Correspondingly, the requirements for the assembly equipment of electronic components of electronic products are also getting higher and higher. Especially in the production process, it often involves the transfer and transfer of electronic components to different equipment and different stations to complete the corresponding assembly work. [0003] At present, the existing transfer device generally has a gripping head, which transfers the workpiece on one pallet or one station to another pallet or station in multiple times, and transfers one workpiece at a time, and the efficiency is relatively low. S...

AI Technical Summary

Problems solved by technology

[0003] At present, the existing transfer device generally has a gripping head, which transfers the workpiece on one pallet or one station to another pallet or station in multiple times, and transfers one workpiece at a time, and the efficiency is relatively low

Some transfer devices are equipped with multiple grippers to transfer multiple workpieces at one time, but the distance between the plurality of grippers is generally fixed. When the spacing and quantity of the gripping head are changed, the existing transfer devices with multiple gripping heads cannot effectively realize the transfer operation. Although this problem can be solved by adding multiple transfer devices, the setting of multiple transfer devices increases the volume. Make the structure of the whole device relatively complicated and increase the manufacturing cost

Images