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Pressure sensor and electronic device

A pressure sensor and pressure technology, applied in the field of sensors, can solve problems such as performance that cannot meet requirements

Active Publication Date: 2020-10-23
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the deficiency that the various performances of the above-mentioned prior art cannot meet the requirements, and provide a pressure sensor with various performances that can meet the requirements

Method used

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  • Pressure sensor and electronic device
  • Pressure sensor and electronic device
  • Pressure sensor and electronic device

Examples

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Embodiment Construction

[0046] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0047] This example embodiment first provides a pressure sensor, with reference to figure 1 Shown is a schematic structural view of an example embodiment of a pressure sensor of the present invention; the pressure sensor may include a base substrate 1, a thin film transistor 2, an insulating layer group 3, an electrode layer and an elastic conductor layer 5; the thin film transistor 2 is arranged on the substrate On the botto...

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Abstract

The invention relates to the technical field of sensors, and provides a pressure sensor and an electronic device. The pressure sensor comprises a substrate, a thin film transistor, an electrode layerand an elastic conductor layer, wherein the thin film transistor is arranged on the substrate; the insulating layer group is arranged on one side, far away from the substrate, of the thin film transistor, and a via hole is formed in the insulating layer group; the electrode layer is arranged on one side, far away from the substrate, of the insulating layer group, the electrode layer comprises a first electrode and a second electrode, an interval space is formed between the first electrode and the second electrode, and the first electrode is connected to a source electrode or a drain electrodeof the thin film transistor through the via hole; the elastic conductor layer is arranged on one side, far away from the substrate, of the electrode layer, and the resistance of the elastic conductorlayer can change along with the change of pressure applied to the elastic conductor layer so that current passing through the space between the first electrode and the second electrode changes. The pressure sensor is high in responsivity, high in sensitivity and ultralow in detection limit.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a pressure sensor and an electronic device including the pressure sensor. Background technique [0002] With the continuous advancement of technology, the depth and breadth of people's collection of surrounding environmental information continue to increase, and flexible pressure sensors, as a very important type of information collection device, have been more and more widely used. Not only that, the replacement of traditional sensing technology with flexible pressure sensing technology has subverted the cognition of the form and function of traditional electronic devices, sensor devices and systems, and this type of device has brought revolution to many aspects of social life. Changes, research on flexible pressure sensors has also become a hot spot in recent years. [0003] However, the various performances of the existing flexible pressure sensors cannot well meet the requir...

Claims

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Application Information

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IPC IPC(8): G01L1/18
CPCG01L1/18
Inventor 梁魁
Owner BOE TECH GRP CO LTD