Manufacturing process of depth-control blind hole of PCB

Abstract

The invention relates to a manufacturing process of a depth-control blind hole of a PCB. The method comprises the following steps: S1, fixing a to-be-drilled working plate, and grounding the to-be-drilled working plate; S2, according to a preset drilling width, grabbing and fixing a drilling tool corresponding to the preset drilling depth; S3, controlling the drilling tool to drill down accordingto the set drilling tool drilling-down parameters, and applying voltage to the drilling tool; S4, detecting the current in the descending process of the drilling tool until the current of the tool nose of the drilling tool is detected, and then, judging that the drilling tool reaches a drilling initial position; and S5, according to the preset drilling depth, controlling the drilling tool to drillthe to-be-drilled working plate from the drilling initial position. The effect of improving the drilling precision of the drilling machine is achieved.

Description

technical field [0001] The present application relates to the field of precision drilling of circuit boards, in particular to a manufacturing process for controlling deep blind holes on PCB boards. Background technique [0002] At present, with the high-precision development of the circuit board industry, the application of interconnection lines between different layers is becoming more and more extensive; the traditional depth-controlled drilling process is to fix the board and adjust the depth of the Z value of the machine to obtain The drilling depth of the working plate is controlled to meet the requirements of the interconnection lines between different levels. [0003] The traditional depth-controlled drilling is a production process that uses the depth of the Z value of the machine to obtain the drilling depth of the work plate. This method of calculating the depth control value at the bottom of the board will be affected by the flatness of the acrylic backing board ...

AI Technical Summary

Problems solved by technology

This method of calculating the depth control value at the bottom of the board will be affected by the flatness of the acrylic backing board surface, the flatness of the hole drilled on the acrylic backing board surface, the flatness of the phenolic resin bottom plate, Influenced by many factors such as the consistency of the thickness between the working plates and the uniformity of the thickness of the same plate surface, the drilling accuracy of the controlled depth can only be controlled within a tolerance of + / -0.20mm, which cannot meet the requirements of multi-level high-precision plate. Accuracy requirements

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