Brittle and hard material double-wire cutting method and device

Abstract

The invention relates to the field of brittle and hard material machining, and discloses a brittle and hard material double-wire cutting method and device. The method comprises the steps of fixing a brittle and hard material; setting positions of a first cutting wire and a second cutting wire so as to enable the first cutting wire to be located in front of the second cutting wire in a cutting feeding direction; and controlling the first cutting wire and the second cutting wire or the brittle and hard material to move in the cutting feeding direction to cut the brittle and hard material. According to the technical scheme, the first cutting wire and the second cutting wire are involved, the first cutting wire is located in front of the second cutting wire in the cutting feeding direction, the brittle and hard material is cut through the first cutting wire and the second cutting wire, and the second cutting wire can conduct secondary cutting or grinding on a cutting end face formed by cutting of the first cutting wire, so that the cutting effect and the cutting efficiency of the brittle and hard material can be greatly improved.

Description

technical field [0001] The invention relates to the field of brittle and hard material processing, in particular to a method and device for double-wire cutting of brittle and hard materials. Background technique [0002] At present, diamond wire is mainly used to cut and cut brittle and hard materials such as stone and silicon crystal. The wire saw is equipped with a plurality of cutting guide wheels to form a cutting wheel train. The diamond wire is a closed circular cutting wire structure. The diamond wire is laid in the guide wheel groove of the cutting wheel train. sports. The cutting action is generally only carried out in the lower half of the diamond wire. The middle part of the wheel train is a window to avoid interference between the wheel train and the ingot. The cutting wheel train is usually driven by a linear motion module installed on the frame. Give, thereby achieving cutting. [0003] Wire saws such as diamond wire have high cutting accuracy, but the cutti...

AI Technical Summary

Problems solved by technology

[0007] For this reason, it is necessary to provide a double-wire cutting method for brittle and hard materials, which is used to solve the technical problems of complex processing procedures and low processing efficiency for brittle and hard materials in the prior art

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