Device and method for preparing bonding test sample piece

A bonding and sample technology, which is applied in the field of equipment for preparing bonding test samples, can solve the problems of the influence of test results and the inability to guarantee the coaxiality of two composite materials

Pending Publication Date: 2020-10-27
重庆恩斯特龙通用航空技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At this stage, when manufacturing bonding test samples, it is necessary to apply adhesive to two pieces of composite materials and then bond them together. Manual control is usually used in the process. There is great dispersion due to different manufacturing environments, and the coaxiality of the two bonded composite materials cannot be guaranteed, which has a great impact on the test results

Method used

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  • Device and method for preparing bonding test sample piece
  • Device and method for preparing bonding test sample piece
  • Device and method for preparing bonding test sample piece

Examples

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Embodiment Construction

[0035] join figure 1 , the bonding test sample includes an upper test piece 5 and a lower test piece 11 parallel to each other (the upper test piece and the lower test piece are made of composite materials, and the specifications are the same), one end of the upper test piece 5 and the lower test piece 11 Bonding by an adhesive (forming a glue layer 17 after curing).

[0036] join Figure 1-Figure 3 , a device for preparing a bonding test sample, including a base 1, the base 1 is provided with a transverse limiter 8, a transverse limiter 2 16, a longitudinal limiter 6 and a longitudinal limiter Two 13, the first horizontal limit block 8, the second horizontal limit block 16 are used to limit the lateral positions of the upper test piece 5 and the lower test piece 11, and the second vertical limit block 13 is used to compress the lower test piece 11 , and the vertical positioning of the upper test piece 5, the longitudinal stopper-6 is used to compress the upper test piece 5 ...

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Abstract

The invention discloses a device and a method for preparing a bonding test sample piece, which can accurately control coaxiality, the adhesive layer width and thickness of a bonding test piece and manufacture a standard bonding test sample piece. The device comprises a base, wherein a first transverse limiting block, a second transverse limiting block, a first longitudinal limiting block and a second longitudinal limiting block are arranged on the base, the first transverse limiting block and the second transverse limiting block are used for limiting transverse positions of the upper test piece and the lower test piece, the second longitudinal limiting block is used for pressing the lower test piece and longitudinally positioning the upper test piece, the first longitudinal limiting blockis used for pressing the upper test piece and the bonding position of the upper test piece and the lower test piece, at least one positioning cushion block is cushioned below the longitudinal limitingblock I, the total thickness of the positioning cushion block is equal to the sum of the thicknesses of adhesive layers at the bonding positions of the longitudinal limiting block II and the bondingtest sample, and one end, corresponding to the lower test piece, of the positioning cushion block is a positioning surface and is used for being matched with the end surface of the lower test piece tolongitudinally position the lower test piece.

Description

technical field [0001] The invention relates to the technical field of bonding materials, in particular to a device and method for preparing bonding test samples. Background technique [0002] At this stage, when manufacturing bonding test samples, it is necessary to apply adhesive to two pieces of composite materials and then bond them. Manual control is usually used in the process. The test samples manufactured by this method vary depending on the skill level and proficiency of the manufacturing personnel. There is great dispersion due to different manufacturing environments, and the coaxiality of the two bonded composite materials cannot be guaranteed, which has a great impact on the test results. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and provide a device and method for preparing bonding test samples. The present invention precisely controls the coaxiality, glue, and bonding of the bondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/28G01N1/36G01N19/04
CPCG01N1/28G01N1/36G01N19/04
Inventor 余建波陈全龙高学静胡瀚杰孙青云刘经奇祝文祥
Owner 重庆恩斯特龙通用航空技术研究院有限公司
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