heat sink

Abstract

The present invention provides a heat sink that can improve the heat dissipation performance of the heat sink while preventing the heat receiving part from being burned out even if there is a forbidden area in the installation space in an environment where the installation space of the heat sink is limited. Homogenizes the heat input in the heated part. The radiator has: a heat transfer component with a heat receiving part thermally connected to the heating element; An integral internal space that communicates with and encloses the working fluid. In the internal space of the heat transfer component, a capillary structure extending from the heat receiving part to the heat dissipation part is accommodated. There is a heat dissipation side step between the heat dissipation parts, the heat dissipation side step part is provided with a step in a direction not parallel to the heat transfer direction of the heat transfer member, and the heat dissipation part is closer to the installation surface side of the heat sink than the heat insulation part.

Description

technical field [0001] The present invention relates to a heat sink that cools a heat generating body such as an electric / electronic component mounted on a substrate such as an electronic circuit board, and more particularly relates to a heat sink capable of cooling a heat generating body even if there is a prohibited area in a narrow space of the board. Background technique [0002] With the increasing functionality of electronic equipment, many components, including heating elements such as electronic components, are mounted at high density on substrates such as electronic circuit boards inside the electronic equipment. In addition, as electronic devices become more functional, the amount of heat generated by heating elements such as electronic components increases. A heat sink may be used as means for cooling a heat generating body such as an electronic component. As the heat sink, generally, a heat pipe type heat sink including a tubular heat pipe is used. [0003] As ...

AI Technical Summary

Problems solved by technology

However, if a heat pipe group composed of a plurality of heat pipes is thermally connected to a heat generating body, the amount of heat received by the heat pipes varies depending on the distance from the heat generating body, so that the heat received by each heat pipe cannot be uniformed, and sufficient cooling performance cannot be obtained. Happening

In addition, there is a chamfer on the outer peripheral surface of each heat pipe, and the gap generated outside the chamfer does not contribute to the heat transfer of the heat pipe group, so the volume of the heat receiving part of the heat pipe group cannot be made large enough, and there is a problem that sufficient cooling cannot be obtained after all. Performance situation

[0006] In addition, since many components are mounted at a high density on the board, there may be a prohibited area for mounting other components in the installation space of the heat sink.

If the heat insulating part and the heat dissipation part of the heat pipe group are retreated away from the substrate in order to avoid the forbidden area on the substrate, in the installation space of a narrow space, the heat pipe group cannot be thermally connected at the central part of the heat sink, and cannot When the heat dissipation performance of the heat sink is sufficiently obtained

In addition, if the heat insulating part and the heat dissipation part of the heat pipe group are retracted in a direction away from the substrate, the number of heat sinks installed in the narrow space is limited, and there is a possibility that the heat dissipation performance of the heat sink cannot be obtained sufficiently. Happening

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