Stress measuring device under collision impact load

Abstract

The invention discloses a stress measuring device under a collision impact load. The device comprises a bottom plate and a portal frame consisting of three mounting plates, the portal frame is fixed on the bottom plate, a PCB fixing mechanism is arranged in the portal frame, the two ends of a PCB are fixed on the PCB fixing mechanism, a collision impact load generating mechanism for applying collision impact to the PCB is arranged right above the PCB, the upper end of the collision impact load generating mechanism is connected with a power transmission mechanism, and the power transmission mechanism is fixed at the top of the portal frame. A strain gauge is attached to the PCB, the strain gauge is connected with a strain indicator through a data line, the strain indicator is connected witha computer, and the strain indicator transmits measured strain data to the computer. The device is simple in structure and convenient to operate, stress measurement under single collision impact andcyclic collision impact loads can be achieved, the stress dynamic change state of a to-be-measured point is measured through the strain gauge, corresponding data is transmitted to the computer for calculation and analysis, the correctness of software simulation is verified, and the experimental research requirement is met.

Description

technical field [0001] The invention relates to the technical field of laboratory instruments and equipment, in particular to a stress measuring device under collision impact load. Background technique [0002] In production, transportation and use, electronic products will inevitably be affected by different factors such as temperature cycle, bending, torsion, vibration, shock, etc., which will lead to failure. Relevant research shows that 70% of the failure of electronic components is caused by the failure of solder joints. . At present, scholars at home and abroad have done a lot of related research on the failure caused by factors such as temperature cycle, bending, torsion, vibration, etc., but under the impact factor, only the failure caused by the drop impact has been studied, and the failure caused by the collision impact load is less. Few, and the relevant test equipment is relatively lacking. Contents of the invention [0003] The object of the present inventio...

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Problems solved by technology

At present, scholars at home and abroad have done a lot of related research on the failure caused by factors such as temperature cycle, bending, torsion, vibration, etc., but under the impact factor, only the relevant research on the failure caused by the drop impact has been carried out, and the failure caused by the collision impact load is less. Few, and relative lack of test equipment

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