Multilayer structure for electronics and related method of manufacture

Abstract

Integrated multilayer structure (100), comprising a substrate film (102) having a first side (102A) and an opposite second side (102B), said substrate film comprising electrically substantially insulating material, a circuit design comprising a number of electrically conductive areas (106) of electrically conductive material on said first and / or second sides of the substrate film, a connector (110) comprising a number of electrically conductive contact elements (118), said connector being provided to the substrate film so that it extends to both said first and second sides of said substrate film and said number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an externalconnecting element (112) responsive to mating the external connecting element with the connector on said first or second side of or adjacent to the substrate film, and at least one plastic layer (104, 105), preferably of thermoplastic material, molded onto said first and / or second side of the substrate film so as to at least partially cover the connector and enhance securing of the connector to the substrate film. Corresponding method of manufacture is presented.

Description

[0001] The project leading to this application has been funded by the European Union's Horizon 2020 research and innovation program under Grant Agreement No. 725076. technical field [0002] In general, the present invention relates to electronic devices, related devices, structures and methods of manufacture. In particular, but not exclusively, the invention relates to providing external electrical connections to the interior of a functional structure comprising an integrated film layer and an adjacent molded plastic layer. Background technique [0003] In the context of electronic devices and electronics, a variety of different stacked assemblies and structures exist. [0004] The motivations behind the integration of electronic devices and related products can be as diverse as the associated context of use. When the final solution finally takes on a multi-layered nature, size savings, weight reduction, cost savings or just effective integration of components are often so...

AI Technical Summary

Problems solved by technology

For example, in the context of a transparent or translucent stacked structure (which may have been further illuminated by a light source such as an LED), surface defects, inconsistencies, And the appearance, which is usually affected by the connected elements, also creates additional defects

[0010] Also, many connection methods currently used in multilayer structures suffer from different durability and reliability issues, for example, in the context of use scenarios where the structure and its connections are subjected to stresses caused by external forces such as bending or torsion , and further limits the configuration of the stack design in terms of, for example, the number of electroactive layers as well as other layers such as molding layers

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