A kind of electroplating copper ball cleaning equipment and cleaning method

Abstract

The invention discloses an electroplated copper ball cleaning device and a cleaning method thereof. The electroplated copper ball cleaning device includes a rotary cleaning mechanism, a screening mechanism and a recovery mechanism. The rotary cleaning mechanism includes a cleaning cylinder body and a circular shaft. The cleaning cylinder has a pickling rotary Cleaning space and clear water rotating cleaning space; screening mechanism, the screening mechanism includes a feeding funnel, the feeding funnel is installed at the bottom of the cleaning cylinder, a separation and screening machine is installed inside the feeding funnel, and copper ball discharge is installed below the feeding funnel machine, the recovery mechanism recovers the liquid in the pickling rotary cleaning space and the clean water rotary cleaning space. The cleaning method utilizes electroplated copper ball cleaning equipment to clean electroplated copper balls; the above electroplated copper ball cleaning equipment and its cleaning method efficiently clean electroplated copper balls through a rotating cleaning mechanism, increasing the efficiency of cleaning copper balls and cleaning The efficiency of the rear copper ball saves energy and reduces the burden of labor.

Description

technical field [0001] The invention belongs to the technical field of electroplating copper ball cleaning, and particularly relates to an electroplating copper ball cleaning device. At the same time, the invention also relates to a cleaning method of the electroplating copper ball cleaning equipment. Background technique [0002] With the rapid development of electronic technology, the production demand of various circuit boards has greatly increased. As an important raw material for electroplating anodes, the demand for copper has greatly increased. Among them, PCB precision circuit boards need to use phosphor bronze balls as anodes. Phosphor bronze balls are suitable for electronic circuit boards, especially high-precision multi-layer circuit boards, which are an indispensable and important component of electronic products. They rely heavily on high-quality PCB phosphor bronze ball anodes as the basic raw materials for manufacturing circuit boards. Therefore, the demand...

AI Technical Summary

Problems solved by technology

If the copper balls used in the electroplating process of the circuit board factory are not cleaned and impurities remain, copper particles will be produced in the copper cylinder, causing the entire circuit board to be scrapped, which brings great hidden dangers to the circuit board

[0003] When new copper balls are used for the first time, there may be impurities, oxide layers and other problems on the surface; after a period of use, anode mud will form on the surface of copper balls, which brings great hidden dangers to the quality of circuit boards. Therefore, the copper ball must be cleaned regularly, and each cleaning will take a lot of manpower and material resources. After the copper ball needs to be poured out of the titanium basket, it needs to be cleaned with a mixed solution of sulfuric acid and hydrogen peroxide, and then rinsed with a large amount of water, and then washed with water. again

One out and one in of copper balls increases the operation action, which makes the cleaning work heavy, the work efficiency is very low, and it also needs to consume a lot of sulfuric acid and hydrogen peroxide

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