Partitioned heating wafer heating device, multi-station dispenser and wafer heating method

Abstract

The invention discloses a partitioned heating wafer heating device, a multi-station dispenser and a wafer heating method. The partitioned heating wafer heating device comprises a heating supporting table, a heating pipe, a heating disc, at least two thermocouples and a temperature controller, and a heating cavity is defined in the heating supporting table; the heating pipe extends into the heatingcavity for heating; the heating plate is attached to the heating supporting table and located above the heating supporting table, a heating surface is formed on the upper surface of the heating plate, the heating plate receives heat of the heating pipe and transmits the heat to a wafer through the heating surface, and at least two heating areas are arranged on the heating plate; the at least twothermocouples are arranged in the at least two heating areas respectively so as to detect the temperature of each heating area; and the temperature controller is connected with the heating pipe and the thermocouples and controls the heating pipe to heat according to the temperature detected by the thermocouples. The partitioned heating wafer heating device and the wafer heating method have the advantages that the wafer is uniformly heated, and the heating process is stable.

Description

technical field [0001] The invention belongs to the field of glue dispensing technology, and more specifically relates to a wafer heating device for zone heating, a multi-station glue dispensing machine with the wafer heating device, and a wafer heating method. Background technique [0002] With the continuous advancement of science and technology, the market demand for semiconductors continues to increase. Wafers are the basic materials for manufacturing semiconductor chips. Wafer dispensing technology is the most important key technology in advanced electronics manufacturing. It is widely used in In chip packaging and integrated circuit equipment, the purpose is to reduce the failure probability of components caused by factors such as cold and heat changes, drops, vibrations, etc. during the use of the product, thereby prolonging the service life of the product. Therefore, dispensing technology is the key and core of electronic packaging technology, and the improvement of ...

AI Technical Summary

Problems solved by technology

However, the current wafer heating device is very prone to temperature differences, resulting in poor dispensing effect and low product yield.

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