LED light-emitting part manufacturing method, LED light-emitting part and light-emitting device
A manufacturing method and technology for light-emitting parts, which can be applied to printing devices, electrical components, and electrical solid-state devices, etc., can solve the problems of easily damaged circuit boards, limited application, and low yield of miniLED finished products.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0028] This embodiment provides an LED lighting device manufacturing method, refer to Figure 1-3 This method includes:
[0029] S101, ready LED substrate 1 to be printed;
[0030] S102, the substrate 1 is placed above the LED printing network 2, and holds the printed web 21 is not in contact with the LED substrate; printing on the web 2 with a through hole on a pad region corresponding to the LED board;
[0031] S103, solder paste is provided on a surface of the printing screen 2, and pressure is applied paste, the paste through the through hole so that, applied to the pad region on the substrate 1 LED;
[0032] S104, the LED chip 11 through the solder paste, and fixed to the LED board 1.
[0033] In this embodiment, LED light emitting element refers to the Mini LED light emitting element, the basic structure is provided in a plurality of the LED chip 11 on the substrate 1, wherein the LED chip 11 according to certain rules are arranged to form an array, the number of LED chips 11...
no. 2 example
[0056] This embodiment provides an LED lighting device manufacturing method, please continue to refer to figure 1 This method includes:
[0057] S101, ready LED substrate 1 to be printed;
[0058] S102, the substrate 1 is placed above the LED printing network 2, and holds the printed web 21 is not in contact with the LED substrate; printing on the web 2 with a through hole on a pad region corresponding to the LED board;
[0059] S103, solder paste is provided on a surface of the printing web 2, by a doctor blade and the paste through the through hole, applied to the pad region on the substrate 1 LED;
[0060] S104, the LED chip 11 through the solder paste, and fixed to the LED board 1.
[0061] Wherein, in the embodiment, the through holes 2 on the printing screen is small is large in the present embodiment, the through-hole portion close to the size of an LED substrate 1 is larger than size of the LED away from the portion of the substrate 1. In the present embodiment the printin...
PUM
Property | Measurement | Unit |
---|---|---|
Height | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com