DBC substrate, DBC substrate manufacturing method and power module

Abstract

The invention discloses a DBC substrate, a DBC substrate manufacturing method and a power module. The DBC substrate comprises a ceramic layer; an upper copper layer bonded to the top of the ceramic layer and a metal heat dissipation layer coupled to the bottom of the ceramic layer; the metal heat dissipation layer is provided with a cavity, a medium inlet and a medium outlet, and the medium inletand the medium outlet are communicated with the cavity. The cavity is used for providing an overflowing space for a cooling medium; a turbulent flow structure protruding relative to the cavity wall isarranged in the cavity; the manufacturing method of the DBC substrate is used for manufacturing the DBC substrate with a cavity structure and a turbulence structure arranged in the cavity structure.The power module comprises the DBC substrate and further comprises a chip, pins and a protection body. The DBC substrate and the power module have good heat dissipation performance, and the DBC substrate with a heat dissipation structure can be manufactured by the DBC substrate.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a DBC substrate, a method for manufacturing the DBC substrate and a power module. Background technique [0002] The power module is a combination of power electronic devices according to certain functions and then potted into a module; because the power module is prone to heat during operation, and higher temperature will affect the normal operation of the power module and affect the performance of the chip; therefore, for It is very important to design an efficient heat dissipation solution for the power module. [0003] The power modules currently on the market generally achieve heat dissipation of the power module by installing a metal radiator (such as a toothed radiator) outside the power module. The metal radiator and the power module are fastened and bonded by a bonding material with thermal conductivity. , however, the heat dissipation efficiency of existing power ...

AI Technical Summary

Problems solved by technology

[0003] The power modules currently on the market generally achieve heat dissipation of the power module by installing a metal radiator (such as a toothed radiator) outside the power module. The metal radiator and the power module are fastened and bonded by a bonding material with thermal conductivity. , however, the cooling efficiency of existing power modules is still limited

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