Package-on-package and package connection system comprising the same

Abstract

The invention provides a package-on-package and a package connection system comprising the same. An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0059710 filed with the Korean Intellectual Property Office on May 21, 2019, the entire disclosure of which is incorporated by reference for all purposes here. technical field [0002] The inventive concept relates to an electronic component module including a semiconductor chip. Background technique [0003] As mobile displays become larger, the need for increased battery capacity is growing. As the battery capacity increases, the area occupied by the battery increases. Therefore, there is a need to reduce the size of a printed circuit board (PCB) provided as a main board. On the other hand, in response to such demand for downsizing, modularization is required in consideration of various components (for example, passive components) and the mounting area of ​​the semiconductor package. Contents of the invention [0004] An aspect of the inventive concept is to provide an ele...

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Problems solved by technology

As the battery capacity increases, the area occupied by the battery increases

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