Automobile circuit board heat dissipation device

A heat dissipation device and circuit board technology, which is applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., can solve the problem of increasing the volume and weight of the heat dissipation system, not having impact resistance, and limited cooling capacity, etc. problem, to achieve the effect of improving heat dissipation performance, rapid heat dissipation, and improving rapid emission

Inactive Publication Date: 2020-11-27
MAANSHAN JULI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This technical solution uses water as the cooling medium, which is circulated and cooled by a water pump and a refrigeration device. However, the cooling capacity of water is limited, so a water storage tank is required, which increases the volume and weight of the heat dissipation system, and does not have impact resistance.

Method used

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  • Automobile circuit board heat dissipation device
  • Automobile circuit board heat dissipation device
  • Automobile circuit board heat dissipation device

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 2

[0053] Such as Figure 5 , 7 shown; others are the same as the first embodiment, the difference is that the structure of the radiator shell 301 of the heat dissipation assembly 11 is different.

[0054] The radiator shell 301 includes a housing box 3011, a spiral shield 3012, a support frame 3013, and a cooling motor mount 3014;

[0055] A spiral protective cover 3012 is installed on the upper surface of the shell box 3011. The spiral protective cover 3012 is made of a hollow copper tube and is in a spiral shape. The spiral protective cover 3012 is divided into an upper protective cover and a lower plate cover; the lower plate cover It communicates with the upper protective cover up and down, and the inside is filled with volatile coolant;

[0056] The upper protective cover is fixedly connected with the shell box body 3011 through the support frame 3013, the end of the support frame 3013 is fixedly connected with the shell box body 3011, and the center part of the support f...

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PUM

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Abstract

The invention relates to the technical field of circuit boards, and particularly relates to an automobile circuit board heat dissipation device. The heat dissipation device comprises a liquid coolingplate, a heat dissipation groove, a loop pipe frame, a branch pipe, a heat conduction seat, a heat conduction adhesive layer, a circuit board protection shell, an input pipe, a return pipe, a heat dissipation assembly and a protection shell, wherein the heat dissipation groove is formed in the liquid cooling plate; the loop pipe frame is located in the heat dissipation groove; the branch pipe is fixedly installed on the loop pipe frame; the branch pipe is communicated with the loop pipe frame; the heat conduction seat is fixedly connected with the top of the liquid cooling plate; the bottom ofthe heat conduction seat is fixedly connected with the heat conduction adhesive layer through a heat conduction adhesive; the circuit board protection shell is fixedly installed on the top of the heat conduction seat; and the circuit board is placed and installed in the circuit board protection shell. The purpose of rapid heat dissipation of the circuit board is achieved, impact resistance protection of the circuit board can be achieved, the heat dissipation efficiency is improved, and meanwhile, the size of the heat dissipation assembly is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board heat dissipation, in particular to a heat dissipation device for an automobile circuit board. Background technique [0002] The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards can be called printed circuit boards or printed circuit boards. The English names are PCB, FPC circuit boards and rigid-flex boards. The birth and development of FPC and PCB have given birth to the new product of rigid-flex boards. Therefore, the soft and hard combination board is the flexible circuit board and the rigid circuit board, which are combined according to the relevant process requirements through pressing and other processes to form a circuit board with FPC characteristics and PCB characteristics. [0003] However, during the use of the circuit board, the electroni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K5/00
CPCH05K5/00H05K7/20254H05K7/20272
Inventor 温从众潘慧耿艳娟
Owner MAANSHAN JULI SCI & TECH
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