Prober

Abstract

The present invention addresses the problem of providing a prober with which it is possible to reduce the influence of current leak from a chuck stage and external noise, eliminate floating capacity of the chuck stage with respect to a prober housing, and perform inspection of a semiconductor device accurately still in the form of a wafer. The problem is solved by a prober comprising: a chuck cover conductive body which includes a bottom conductor and a side conductor, wherein the chuck stage can be housed in a space enclosed by the bottom conductor and the side conductor, the chuck cover conductive body having an upper opening; an upper cover conductive body which has a through-hole allowing for passage of support conductive portions of a surface electrode probe and a back-surface electrode probe, and is sized so as to cover at least the opening of the chuck cover conductive body in plan view, even when a contact portion of the surface electrode probe is relatively moved in a wafer tobe inspected during inspection; and a means for bringing the chuck cover conductive body and the upper cover conductive body into contact and electrical conduction with each other.

Description

technical field [0001] The present invention relates to a probe station. Specifically, it relates to a probe station used when inspecting electrical characteristics of a semiconductor device having electrodes on both surfaces of a wafer substrate while maintaining a wafer state. Background technique [0002] As power semiconductor devices such as power transistors, power MOSFETs, IGBTs (Insulated Gate Bipolar Transistors, insulated gate bipolar transistors), semiconductor devices such as LEDs, and semiconductor lasers, there are semiconductor devices that are configured so that current flows up and down the chip , with electrodes on the front and back sides of the wafer substrate. Therefore, in order to inspect the electrical characteristics of such a semiconductor device while maintaining the wafer state, it is necessary to establish a structure that can be electrically connected to the front and back sides of the wafer. Various probe stations have been proposed for contac...

AI Technical Summary

Problems solved by technology

However, the probe stations disclosed in these patent documents 1 and 2 are probe stations for inspecting semiconductor devices that exist alone, and are not probe stations for inspecting semiconductor devices while maintaining the state of the wafer. How to maintain the accuracy of the state of the wafer well characterizes semiconductor devices with electrodes on both front and back sides, does not provide any insight

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