Conductive material, ultrasonic fingerprint module and electronic equipment

A conductive material and quality technology, applied in the direction of acquiring/arranging fingerprints/palmprints, electrical digital data processing, character and pattern recognition, etc., can solve the problem of fingerprint module recognition effect deviation, module recognition accuracy is not high, material distribution is not good Uniformity and other issues, to achieve low signal-to-noise ratio, reduce costs, and reduce the content of silver particles

Inactive Publication Date: 2020-12-01
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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  • Summary
  • Abstract
  • Description
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Problems solved by technology

However, due to the presence of large silver particles in the silver paste, the silver paste is not mixed sufficiently, and the cured material is unevenly distributed, so that when the ultrasonic wave penetrates the conductive electrode, the signal in the large silver particle is different from the signal in other areas. The recognition effect of the fingerprint module is biased, and the recognition accuracy of the entire module is not high

Method used

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  • Conductive material, ultrasonic fingerprint module and electronic equipment
  • Conductive material, ultrasonic fingerprint module and electronic equipment
  • Conductive material, ultrasonic fingerprint module and electronic equipment

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0055] It should be noted that when a component is said to be "electrically connected" to another component, it may be directly on the other component or there may be an intervening component. When one component is said to be "electrically connected" to another component, it may be connected by contact, eg, by means of a wire connection, or non-contact, eg, by means of a non-contact coupling.

[0056] Unless otherwise defined, all technical and scientific term...

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Abstract

The invention provides a conductive material which is obtained after prepared silver paste is cured, the silver paste comprises, by mass, 55%-65% of silver powder, the silver powder is formed by mixing flaky silver powder and spherical silver powder, and the mass ratio of the flaky silver powder to the spherical silver powder ranges from 7: 3 to 8: 2 and is resin with the mass ratio of 16%-20%; the mass ratio of the solvent is 10%-14%; and an aid. Compared with the prior art, the conductive material has good adhesive force on the surface of a piezoelectric layer (generally fluoride), the surface roughness of the material is low, large silver particles do not exist in the material, and the silver particles are not aggregated. The invention also provides an ultrasonic fingerprint module andelectronic equipment.

Description

technical field [0001] The invention relates to the technical field of fingerprint identification, in particular to a conductive material, an ultrasonic fingerprint module and electronic equipment. Background technique [0002] In the field of ultrasonic fingerprint recognition technology, the conductive electrode inside the fingerprint recognition module needs to receive the sinusoidal electrical signal sent by the drive IC, and the ultrasonic wave will penetrate the conductive electrode, and then the electrode material must have excellent conductivity, the surface of the material must be flat, and it needs to be The surface of the piezoelectric layer has good adhesion. [0003] In the process of realizing the present application, the inventors have found that there are at least the following problems in the prior art: the materials for making conductive electrodes are usually mixed large-grained silver particles, film-forming carriers and solvents. These materials are firs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06F3/041
CPCG06F3/0416G06V40/1306
Inventor 刘宣宣
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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