Laser encapsulation method

Abstract

The present invention provides a laser encapsulation method, which uses a laser beam to irradiate glass frit coated along a encapsulation path between a group of glass substrates for encapsulation. When cracking the area, reduce the laser power or reduce the laser power and scan rate at the same time. Different laser power and scanning speed are used in the crackable area and other areas of the packaging path. On the one hand, it can protect the crackable area from being damaged by excessive laser power. On the other hand, in the area outside the crackable area, you can use Higher laser power and faster scanning speed help to improve packaging efficiency and product qualification rate, thereby increasing output.

Description

technical field [0001] The invention relates to the field of glass substrate packaging, in particular to a laser packaging method. Background technique [0002] Glass substrates are commonly used in fields such as flat panel displays and solar cells as substrates for making structures such as OLED devices and photovoltaic devices. In order to prevent device degradation, polymer adhesives or high-temperature sintered glass frit are usually used to separate A glass cover plate is bonded to the glass substrate to form a glass sealing body. Similar glass seals are also used in other fields, such as preventing electrolyte leakage in BIPV (Building Integrated Photovoltaic) module manufacturing, preventing discharge gas leakage in PDP panel manufacturing, and double-layer vacuum glass structures that require long-term Maintain a high vacuum and so on. [0003] Compared with the polymer adhesive method, the use of glass frit as the sealing material can achieve better airtightness....

AI Technical Summary

Problems solved by technology

However, due to the difference in the structure (or circuit) on the surface of the glass substrate coated with glass frit, when using the same power and scanning rate for encapsulation, a good encapsulation effect can be achieved in some areas, but in another specific area (such as TP lead area of ​​the OLED glass substrate), but there will be missing or over-burning or even cracks, resulting in a decrease in productivity (or packaging quality), so it is necessary to find a laser packaging solution that can take into account both productivity and packaging efficiency

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